Packaging Market For Compound Semiconductor By Packaging Platform (Flip Chip, Embedded Die, Fan-In WLP, and Fan-Out WLP), Application (CS Power Electronics, CS RF/Microwave, CS Photonics, CS Sensing, and CS Quantum), and End User (Digital Economy, Industrial and Energy & Power, Defense/Security, Transport, Consumer Electronics, Healthcare, and Space): Global Opportunity Analysis and Industry Forecast, 2020–2027

包装の世界市場2020–2027:機会分析・産業予測

◆タイトル:Packaging Market For Compound Semiconductor By Packaging Platform (Flip Chip, Embedded Die, Fan-In WLP, and Fan-Out WLP), Application (CS Power Electronics, CS RF/Microwave, CS Photonics, CS Sensing, and CS Quantum), and End User (Digital Economy, Industrial and Energy & Power, Defense/Security, Transport, Consumer Electronics, Healthcare, and Space): Global Opportunity Analysis and Industry Forecast, 2020–2027
◆商品コード:ALD20NV60
◆調査・発行会社:MarketsandMarkets
◆発行日:2020年9月
◆ページ数:205
◆レポート形式:PDF / 英語
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル
◆産業分野:半導体・電子
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【レポートの概要】

本調査レポートでは、化合物半導体用パッケージングの世界市場を調査・分析することにより、イントロダクション、エグゼクティブサマリー、市場概要、パッケージングプラットフォーム別(フリップチップ、エンベデッドダイ、ファンインWLP、ファンアウトWLP)分析、用途別(CSパワーエレクトロニクス、CS RF・マイクロ波、CSフォトニクス、CSセンシング、CS量子)分析、エンドユーズ別(デジタルエコノミー、工業・エネルギー・電力、防衛・セキュリティー、輸送、家電、医療、宇宙)分析、地域別分析、企業情報と今後の方向性を明らかに致します。
・イントロダクション
・エグゼクティブサマリー
・市場概要
・化合物半導体用パッケージングの世界市場規模:パッケージングプラットフォーム別(フリップチップ、エンベデッドダイ、ファンインWLP、ファンアウトWLP)
・化合物半導体用パッケージングの世界市場規模:用途別(CSパワーエレクトロニクス、CS RF・マイクロ波、CSフォトニクス、CSセンシング、CS量子)
・化合物半導体用パッケージングの世界市場規模:エンドユーズ別(デジタルエコノミー、工業・エネルギー・電力、防衛・セキュリティー、輸送、家電、医療、宇宙)
・化合物半導体用パッケージングの世界市場規模:地域別
・企業情報

The global packaging market for compound semiconductor size was valued at $11.63 billion in 2019, and is projected to reach $25.61 billion by 2027, growing at a CAGR of 10.4% from 2020 to 2027. Compound semiconductors are produced by laminating the layers composed of two or more elements with a thickness ranging from several nanometers to micrometers and it uses different combinations of elements in each layer.
The wafer process differs according to material properties. Moreover, some CS devices contain fragile air bridges, gold bond pads, topographical cavities & trenches, and have a number of unique bulk material properties which are sensitive to the mechanical and chemical processes associated with standard packaging technique.
Thus, the standard electronics packaging and interconnection technologies have become the limiting factor determining the performance and efficiency of the new semiconductor components. Whereas, the advanced packaging technology provides several advantages such as prevention from physical damage, maximize operational efficiency, and reduces overall cost.

In addition, in consumer electronics and industrial products advance packaging relies on mechanical engineering principles such as dynamics, stress analysis, heat transfer, and fluid mechanics and protects components from mechanical damage, cooling, RF noise emission, and electrostatic discharge. Thus, in order to improve the performance, reliability, and cost-effectiveness of electronics systems, an advanced packaging technology is being used for packaging of compound semiconductors.
Factors such as increase in demand for miniaturization of devices, improved system performance and optimization of compound semiconductor packaging, and emerging trends toward compound semiconductor wafers in the automotive industry are major factors driving the market growth to a certain extent.
However, high cost of compound semiconductor packaging is hampering its adoption is expected to pose a major threat to the compound semiconductor packaging market globally. However, emerging usage of compound semiconductors in smart technologies and emerging trends of fan-out wafer level packaging is expected to provide lucrative opportunities to the market growth globally.
The global packaging market for compound semiconductor is segmented into packaging platform, application, end user, and region. Based on packaging platform, the market is divided into flip-chip, embedded die, fan-in WLP, and fan-out WLP. On the basis of application, the packaging market for compound semiconductor is analyzed across CS power electronics, CS RF/Microwave, CS Photonics, CS Sensing, and CS Quantum.
By end user, the market is studies across digital economy, industrial and energy & power, defense/security, transport, consumer electronics, healthcare, and space. By region, the packaging market for compound semiconductor trends are analyzed across the U.S., the UK, China, and rest of the world.

The key players operating in the market includes Amkor Technology, Taiwan Semiconductor Manufacturing Company, Texas Instruments, Jiangsu Changjiang Electronics Tech Co., ASE Technology, KLA Corporation, Qorvo, Tokyo Electron Limited, Deca Technologies Inc., and Fujitsu Limited. These key players have adopted various strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations, to increase their market penetration and strengthen their foothold in the industry.

Key Benefits For Stakeholders
• This study comprises analytical depiction of the global packaging market size for compound semiconductor along with the current trends and future estimations to depict the imminent investment pockets.
• The overall packaging market analysis for compound semiconductor is determined to understand the profitable trends to gain a stronger foothold.
• The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
• The current packaging market forecast for compound semiconductor is quantitatively analyzed from 2019 to 2027 to benchmark the financial competency.
• Porter’s five forces analysis illustrates the potency of the buyers and the packaging market share for compound semiconductor of key vendors.
Packaging Market For Compound Semiconductor Key Segments

By Packaging Platform
• Flip Chip
• Embedded Die
• Fan-In WLP
• Fan-Out WLP

By Application
• Compound Semiconductor Power Electronics
• Compound Semiconductor RF/Microwave
• Compound Semiconductor Photonics
• Compound Semiconductor Sensing
• Compound Semiconductor Quantum

By End User
• Digital Economy
• Industrial and Energy & Power
• Defense/Security
• Transport
• Consumer Electronics
• Healthcare
• Space

By Region
• U.S.
• UK
• China
• Rest of the World
Key Market Players
• Amkor Technology
• ASE Technology
• Deca Technologies Inc.
• Fujitsu Limited
• Jiangsu Changjiang Electronics Tech Co.
• KLA Corporation
• Qorvo
• Taiwan Semiconductor Manufacturing Company
• Texas Instruments
• Tokyo Electron Limited

【レポートの目次】

Chapter 1:Introduction

1.1.Report description
1.2.Key benefits for stakeholders
1.3.Key market segments
1.4.Research methodology

1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models

Chapter 2:Executive summary

2.1.Key findings

2.1.1.Top impacting factors
2.1.2.Top investment pockets

2.2.CXO perspective

Chapter 3:MARKET OVERVIEW

3.1.Market definition and scope
3.2.Key forces shaping packaging market for compound semiconductor
3.3.Covid-19 impact analysis

3.3.1.COVID-19 Outbreak
3.3.2.Impact on market size
3.3.3.End user trends, preferences, and budget impact
3.3.4.Parent industry impact
3.3.5.Opportunity window

3.4.Top winning strategies
3.5.Market dynamics

3.5.1.Drivers

3.5.1.1.Increase in demand for miniaturization of devices
3.5.1.2.Improved system performances and optimization of compound semiconductor packaging
3.5.1.3.Emerging trends towards semiconductor wafers in automotive industry

3.5.2.Restraint

3.5.2.1.High cost of compound semiconductor packaging is hampering its adoption

3.5.3.Opportunity

3.5.3.1.Emerging usage of compound semiconductors in smart technologies
3.5.3.2.Emerging trends of fan-out wafer level packaging

Chapter 4:packaging market for Compound semiconductor, BY packaging platform

4.1.Overview
4.2.Flip Chip

4.2.1.Key market trends, growth factors, and opportunities
4.2.2.Market size and forecast, by region
4.2.3.Market analysis by country

4.3.Embedded Die

4.3.1.Key market trends, growth factors, and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market analysis by country

4.4.Fan-in WLP

4.4.1.Key market trends, growth factors, and opportunities
4.4.2.Market size and forecast, by region
4.4.3.Market analysis by country

4.5.Fan-out WLP

4.5.1.Key market trends, growth factors, and opportunities
4.5.2.Market size and forecast, by region
4.5.3.Market analysis by country

Chapter 5:packaging market for Compound semiconductor, BY Application

5.1.Overview
5.2.CS Power Electronics

5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by region
5.2.3.Market size and forecast, by end user
5.2.4.Market analysis by country

5.3.CS RF/Microwave

5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region
5.3.3.Market size and forecast, by end user
5.3.4.Market analysis by country

5.4.CS Photonics

5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region
5.4.3.Market size and forecast, by end user
5.4.4.Market analysis by country

5.5.CS Sensing

5.5.1.Key market trends, growth factors, and opportunities
5.5.2.Market size and forecast, by region
5.5.3.Market size and forecast, by end user
5.5.4.Market analysis by country

5.6.CS Quantum

5.6.1.Key market trends, growth factors, and opportunities
5.6.2.Market size and forecast, by region
5.6.3.Market size and forecast, by end user
5.6.4.Market analysis by country

Chapter 6:PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY End Use

6.1.Overview
6.2.Digital Economy

6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by region
6.2.3.Market analysis by country

6.3.Industrial and Energy & Power

6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by region
6.3.3.Market analysis by country

6.4.Defense/Security

6.4.1.Key market trends, growth factors, and opportunities
6.4.2.Market size and forecast, by region
6.4.3.Market analysis by country

6.5.Transport

6.5.1.Key market trends, growth factors, and opportunities
6.5.2.Market size and forecast, by region
6.5.3.Market analysis by country

6.6.Consumer Electronics

6.6.1.Key market trends, growth factors, and opportunities
6.6.2.Market size and forecast, by region
6.6.3.Market analysis by country

6.7.Healthcare

6.7.1.Key market trends, growth factors, and opportunities
6.7.2.Market size and forecast, by region
6.7.3.Market analysis by country

6.8.Space

6.8.1.Key market trends, growth factors, and opportunities
6.8.2.Market size and forecast, by region
6.8.3.Market analysis by country

Chapter 7:PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY Region

7.1.Overview

7.1.1.1.U.S.

7.1.1.1.1.Market size and forecast, by packaging platform
7.1.1.1.2.Market size and forecast, by Application
7.1.1.1.3.Market size and forecast, by end user
7.1.1.1.4.Market size and forecast, application by end user

7.1.1.2.UK

7.1.1.2.1.Market size and forecast, by packaging platform
7.1.1.2.2.Market size and forecast, by Application
7.1.1.2.3.Market size and forecast, by end user
7.1.1.2.4.Market size and forecast, application by end user

7.1.1.3.China

7.1.1.3.1.Market size and forecast, by packaging platform
7.1.1.3.2.Market size and forecast, by Application
7.1.1.3.3.Market size and forecast, by end user
7.1.1.3.4.Market size and forecast, application by end user

7.1.1.4.Rest of the World

7.1.1.4.1.Market size and forecast, by packaging platform
7.1.1.4.2.Market size and forecast, by Application
7.1.1.4.3.Market size and forecast, by end user
7.1.1.4.4.Market size and forecast, application by end user

Chapter 8:Company profiles

8.1.AMKOR TECHNOLOGY

8.1.1.Company overview
8.1.2.Key executive
8.1.3.Company snapshot
8.1.4.Product portfolio
8.1.5.R&D expenditure
8.1.6.Business performance
8.1.7.Key strategic moves and developments

8.2.Advanced Semiconductor Engineering, Inc.

8.2.1.Company overview
8.2.2.Key Executives
8.2.3.Company snapshot
8.2.4.Operating business segments
8.2.5.Product portfolio
8.2.6.R&D Expenditure
8.2.7.Business performance
8.2.8.Key strategic moves and developments

8.3.Deca Technologies Inc.

8.3.1.Company overview
8.3.2.Key Executives
8.3.3.Company snapshot
8.3.4.Operating business segments
8.3.5.Product portfolio
8.3.6.Key strategic moves and developments

8.4.FUJITSU LIMITED

8.4.1.Company overview
8.4.2.Key executive
8.4.3.Company snapshot
8.4.4.Operating business segments
8.4.5.Product portfolio
8.4.6.R&D expenditure
8.4.7.Business performance
8.4.8.Key strategic moves and developments

8.5.Jiangsu Changjiang Electronics Tech Co.

8.5.1.Company overview
8.5.2.Key Executives
8.5.3.Company snapshot
8.5.4.Product portfolio
8.5.5.Business performance

8.6.KLA Corporation

8.6.1.Company overview
8.6.2.Key Executives
8.6.3.Company snapshot
8.6.4.Product portfolio
8.6.5.R&D Expenditure
8.6.6.Business performance
8.6.7.Key strategic moves and developments

8.7.Qorvo

8.7.1.Company overview
8.7.2.Key Executives
8.7.3.Company snapshot
8.7.4.Operating business segments
8.7.5.Product portfolio
8.7.6.Business performance

8.8.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

8.8.1.Company overview
8.8.2.Key executive
8.8.3.Company snapshot
8.8.4.Product portfolio
8.8.5.R&D expenditure
8.8.6.Business performance
8.8.7.Key strategic moves and developments

8.9.TEXAS INSTRUMENTS INCORPORATED

8.9.1.Company overview
8.9.2.Key executive
8.9.3.Company snapshot
8.9.4.Operating business segments
8.9.5.Product portfolio
8.9.6.R&D expenditure
8.9.7.Business performance

8.10.Tokyo Electron Limited

8.10.1.Company overview
8.10.2.Company snapshot
8.10.3.Product portfolio
8.10.4.R&D expenditure
8.10.5.Business performance

LIST OF TABLES

TABLE 01.GLOBAL PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY PACKAGING PLATFORM, 2019–2027($MILLION)
TABLE 02.FLIP CHIP PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY REGION, 2019–2027($MILLION)
TABLE 03.EMBEDDED DIE PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY REGION, 2019–2027($MILLION)
TABLE 04.FAN-IN WLP PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY REGION, 2019–2027($MILLION)
TABLE 05.FAN-IN WLP PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY REGION, 2019–2027($MILLION)
TABLE 06.GLOBAL PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY APPLICATION, 2019–2027($MILLION)
TABLE 07.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY REGION, 2019–2027($MILLION)
TABLE 08.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY END USER, 2019–2027($MILLION)
TABLE 09.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY REGION, 2019–2027($MILLION)
TABLE 10.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY END USER, 2019–2027($MILLION)
TABLE 11.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY REGION, 2019–2027($MILLION)
TABLE 12.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY END USER, 2019–2027($MILLION)
TABLE 13.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY REGION, 2019–2027($MILLION)
TABLE 14.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY END USER, 2019–2027($MILLION)
TABLE 15.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY REGION, 2019–2027($MILLION)
TABLE 16.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY END USER, 2019–2027($MILLION)
TABLE 17.GLOBAL PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY END USER, 2019–2027($MILLION)
TABLE 18.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN DIGITAL ECONOMY, BY REGION, 2019–2027($MILLION)
TABLE 19.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN INDUSTRIAL AND ENERGY & POWER, BY REGION, 2019–2027($MILLION)
TABLE 20.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN DEFENSE/SECURITY, BY REGION, 2019–2027($MILLION)
TABLE 21.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN TRANSPORT, BY REGION, 2019–2027($MILLION)
TABLE 22.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN CONSUMER ELECTRONICS, BY REGION, 2019–2027($MILLION)
TABLE 23.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN HEALTHCARE, BY REGION, 2019–2027($MILLION)
TABLE 24.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SPACE, BY REGION, 2019–2027($MILLION)
TABLE 25.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY PACKAGING PLATFORM, 2019–2027($MILLION)
TABLE 26.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY APPLICATION, 2019–2027($MILLION)
TABLE 27.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY END USER, 2019–2027($MILLION)
TABLE 28.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY END USER, 2019–2027($MILLION)
TABLE 29.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY END USER, 2019–2027($MILLION)
TABLE 30.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY END USER, 2019–2027($MILLION)
TABLE 31.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY END USER, 2019–2027($MILLION)
TABLE 32.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY END USER, 2019–2027($MILLION)
TABLE 33.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY PACKAGING PLATFORM, 2019–2027($MILLION)
TABLE 34.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY APPLICATION, 2019–2027($MILLION)
TABLE 35.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY END USER, 2019–2027($MILLION)
TABLE 36.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY END USER, 2019–2027($MILLION)
TABLE 37.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY END USER, 2019–2027($MILLION)
TABLE 38.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY END USER, 2019–2027($MILLION)
TABLE 39.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY END USER, 2019–2027($MILLION)
TABLE 40.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY END USER, 2019–2027($MILLION)
TABLE 41.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY PACKAGING PLATFORM, 2019–2027($MILLION)
TABLE 42.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY APPLICATION, 2019–2027($MILLION)
TABLE 43.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY END USER, 2019–2027($MILLION)
TABLE 44.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY END USER, 2019–2027($MILLION)
TABLE 45.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY END USER, 2019–2027($MILLION)
TABLE 46.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY END USER, 2019–2027($MILLION)
TABLE 47.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY END USER, 2019–2027($MILLION)
TABLE 48.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY END USER, 2019–2027($MILLION)
TABLE 49.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY PACKAGING PLATFORM, 2019–2027($MILLION)
TABLE 50.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY APPLICATION, 2019–2027($MILLION)
TABLE 51.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY END USER, 2019–2027($MILLION)
TABLE 52.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY END USER, 2019–2027($MILLION)
TABLE 53.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY END USER, 2019–2027($MILLION)
TABLE 54.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY END USER, 2019–2027($MILLION)
TABLE 55.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY END USER, 2019–2027($MILLION)
TABLE 56.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY END USER, 2019–2027($MILLION)
TABLE 57.AMKOR TECHNOLOGY.: COMPANY SNAPSHOT
TABLE 58.AMKOR TECHNOLOGY: VIDEO ANALYTICS PRODUCT PORTFOLIO
TABLE 59.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: KEY EXECUTIVES
TABLE 60.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: COMPANY SNAPSHOT
TABLE 61.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: OPERATING SEGMENTS
TABLE 62.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: PRODUCT PORTFOLIO
TABLE 63.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 64.DECA TECHNOLOGIES INC.: KEY EXECUTIVES
TABLE 65.DECA TECHNOLOGIES INC.: COMPANY SNAPSHOT
TABLE 66.DECA TECHNOLOGIES INC.: PRODUCT PORTFOLIO
TABLE 67.FUJITSU LIMITED: KEY EXECUTIVE
TABLE 68.FUJITSU LIMITED: COMPANY SNAPSHOT
TABLE 69.FUJITSU LIMITED: OPERATING SEGMENTS
TABLE 70.FUJITSU LIMITED: PRODUCT PORTFOLIO
TABLE 71.JIANGSU CHANGJIANG ELECTRONICS TECH CO: KEY EXECUTIVES
TABLE 72.JIANGSU CHANGJIANG ELECTRONICS TECH CO: COMPANY SNAPSHOT
TABLE 73.JIANGSU CHANGJIANG ELECTRONICS TECH CO: PRODUCT PORTFOLIO
TABLE 74.KLA CORPORATION: KEY EXECUTIVES
TABLE 75.KLA CORPORATION: COMPANY SNAPSHOT
TABLE 76.KLA CORPORATION: PRODUCT PORTFOLIO
TABLE 77.KLA CORPORATION: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 78.QORVO: KEY EXECUTIVES
TABLE 79.QORVO: COMPANY SNAPSHOT
TABLE 80.QORVO: OPERATING SEGMENTS
TABLE 81.QORVO: PRODUCT PORTFOLIO
TABLE 85.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 86.TEXAS INSTRUMENTS INCORPORATED: KEY EXECUTIVE
TABLE 87.TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT
TABLE 88.TEXAS INSTRUMENTS INCORPORATED: OPERATING SEGMENTS
TABLE 89.TEXAS INSTRUMENTS INCORPORATED: PRODUCT PORTFOLIO
TABLE 90.TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT
TABLE 91.TOKYO ELECTRON LIMITED: PRODUCT PORTFOLIO

LIST OF FIGURES

FIGURE 01.KEY MARKET SEGMENTS
FIGURE 02.EXECUTIVE SUMMARY
FIGURE 03.EXECUTIVE SUMMARY
FIGURE 04.TOP IMPACTING FACTORS
FIGURE 05.TOP INVESTMENT POCKETS
FIGURE 06.MODERATE BARGAINING POWER OF SUPPLIERS
FIGURE 07.MODERATE TO HIGH THREAT OF NEW ENTRANTS
FIGURE 08.MODERATE THREAT OF SUBSTITUTES
FIGURE 09.MODERATE INTENSITY OF RIVALRY
FIGURE 10.MODERATE TO HIGH BARGAINING POWER OF BUYERS
FIGURE 11.TOP WINNING STRATEGIES, BY YEAR, 2017–2020
FIGURE 12.TOP WINNING STRATEGIES, BY YEAR, 2017–2020
FIGURE 13.TOP WINNING STRATEGIES, BY COMPANY, 2017–2020
FIGURE 14.GLOBAL PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY PACKAGING PLATFORM, 2020–2027
FIGURE 15.COMPARATIVE SHARE ANALYSIS OF FLIP CHIP PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY COUNTRY, 2019 & 2027 (%)
FIGURE 16.COMPARATIVE SHARE ANALYSIS OF EMBEDDED DIE PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY COUNTRY, 2019 & 2027 (%)
FIGURE 17.COMPARATIVE SHARE ANALYSIS OF FAN-IN WLP PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY COUNTRY, 2019 & 2027 (%)
FIGURE 18.COMPARATIVE SHARE ANALYSIS OF FAN-IN WLP PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY COUNTRY, 2019 & 2027 (%)
FIGURE 19.GLOBAL COMPOUND SEMICONDUCTOR PACKAGING MARKET, BY APPLICATION, 2020–2027
FIGURE 20.COMPARATIVE SHARE ANALYSIS OF PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY COUNTRY, 2019 & 2027 (%)
FIGURE 21.COMPARATIVE SHARE ANALYSIS OF PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY COUNTRY, 2019 & 2027 (%)
FIGURE 22.COMPARATIVE SHARE ANALYSIS OF PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY COUNTRY, 2019 & 2027 (%)
FIGURE 23.COMPARATIVE SHARE ANALYSIS OF PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY COUNTRY, 2019 & 2027 (%)
FIGURE 24.COMPARATIVE SHARE ANALYSIS OF PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY COUNTRY, 2019 & 2027 (%)
FIGURE 25.GLOBAL PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY END USER, 2020–2027
FIGURE 26.COMPARATIVE SHARE ANALYSIS OF PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN DIGITAL ECONOMY, BY COUNTRY, 2019 & 2027 (%)
FIGURE 27.COMPARATIVE SHARE ANALYSIS OF PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN INDUSTRIAL AND ENERGY & POWER, BY COUNTRY, 2019 & 2027 (%)
FIGURE 28.COMPARATIVE SHARE ANALYSIS OF PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN DEFENSE/SECURITY, BY COUNTRY, 2019 & 2027 (%)
FIGURE 29.COMPARATIVE SHARE ANALYSIS OF SHARE PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN TRANSPORT, BY COUNTRY, 2019 & 2027 (%)
FIGURE 30.COMPARATIVE SHARE ANALYSIS OF SHARE PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN CONSUMER ELECTRONICS, BY COUNTRY, 2019 & 2027 (%)
FIGURE 31.COMPARATIVE SHARE ANALYSIS OF SHARE PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN HEALTHCARE, BY COUNTRY, 2019 & 2027 (%)
FIGURE 32.COMPARATIVE SHARE ANALYSIS OF SHARE PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SPACE, BY COUNTRY, 2019 & 2027 (%)
FIGURE 33.GLOBAL PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY REGION, 2020–2027
FIGURE 34.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, 2019–2027($MILLION)
FIGURE 35.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, 2019–2027($MILLION)
FIGURE 36.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, 2019–2027($MILLION)
FIGURE 37.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, 2019–2027($MILLION)
FIGURE 38.AMKOR TECHNOLOGY: KEY EXECUTIVE
FIGURE 39.AMKOR TECHNOLOGY: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 40.AMKOR TECHNOLOGY: REVENUE, 2017–2019 ($BILLION)
FIGURE 41.AMKOR TECHNOLOGY: REVENUE SHARE BY REGION, 2019 (%)
FIGURE 42.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 43.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: REVENUE, 2017–2019 ($MILLION)
FIGURE 44.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: REVENUE SHARE BY SEGMENT, 2019 (%)
FIGURE 45.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: REVENUE SHARE BY REGION, 2019 (%)
FIGURE 46.R&D EXPENDITURE, 2016–2018 ($MILLION)
FIGURE 47.FUJITSU LIMITED: REVENUE, 2016–2018 ($MILLION)
FIGURE 48.FUJITSU LIMITED: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 49.FUJITSU LIMITED: REVENUE SHARE BY REGION, 2018 (%)
FIGURE 50.JIANGSU CHANGJIANG ELECTRONICS TECH CO: NET SALES, 2017–2019 ($MILLION)
FIGURE 51.KLA CORPORATION: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 52.KLA CORPORATION: REVENUE, 2017–2019 ($MILLION)
FIGURE 53.KLA CORPORATION: REVENUE SHARE BY REGION, 2019 (%)
FIGURE 54.QORVO: REVENUE, 2017–2019 ($MILLION)
FIGURE 55.QORVO: REVENUE SHARE BY SEGMENT, 2019 (%)
FIGURE 56.QORVO: REVENUE SHARE BY REGION, 2019 (%)
FIGURE 57.R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 58.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE, 2017–2019 ($MILLION)
FIGURE 59.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE SHARE BY REGION, 2019 (%)
FIGURE 60.R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 61.TEXAS INSTRUMENTS INCORPORATED: REVENUE, 2017–2019 ($MILLION)
FIGURE 62.TEXAS INSTRUMENTS INCORPORATED: REVENUE SHARE BY SEGMENT, 2019 (%)
FIGURE 63.TEXAS INSTRUMENTS INCORPORATED: REVENUE SHARE BY REGION, 2019 (%)
FIGURE 64.R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 65.TOKYO ELECTRON LIMITED: REVENUE, 2017–2019 ($MILLION)
FIGURE 66.TOKYO ELECTRON LIMITED: REVENUE SHARE BY SEGMENT, 2019 (%)
FIGURE 67.TOKYO ELECTRON LIMITED: REVENUE SHARE BY REGION, 2019 (%)

★調査レポート[包装の世界市場2020–2027:機会分析・産業予測] ( Packaging Market For Compound Semiconductor By Packaging Platform (Flip Chip, Embedded Die, Fan-In WLP, and Fan-Out WLP), Application (CS Power Electronics, CS RF/Microwave, CS Photonics, CS Sensing, and CS Quantum), and End User (Digital Economy, Industrial and Energy & Power, Defense/Security, Transport, Consumer Electronics, Healthcare, and Space): Global Opportunity Analysis and Industry Forecast, 2020–2027 / ALD20NV60) 販売に関する免責事項
[包装の世界市場2020–2027:機会分析・産業予測] ( Packaging Market For Compound Semiconductor By Packaging Platform (Flip Chip, Embedded Die, Fan-In WLP, and Fan-Out WLP), Application (CS Power Electronics, CS RF/Microwave, CS Photonics, CS Sensing, and CS Quantum), and End User (Digital Economy, Industrial and Energy & Power, Defense/Security, Transport, Consumer Electronics, Healthcare, and Space): Global Opportunity Analysis and Industry Forecast, 2020–2027 / ALD20NV60) についてEメールでお問い合わせ


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