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Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Deposition), Back-end Equipment, Fab Facility Equipment, Product Type, Dimension, Supply Chain Participant, Region - Global Forecast to 2025

世界の半導体製造装置市場：フロントエンド装置別（リソグラフィー、ウェーハ表面調整、堆積）、バックエンド装置別、製造施設機器別、製品種類別、寸法別、サプライチェーン参加者別、地域別

◆タイトル：Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Deposition), Back-end Equipment, Fab Facility Equipment, Product Type, Dimension, Supply Chain Participant, Region - Global Forecast to 2025
◆商品コード：SE 5344
◆調査・発行会社：MarketsandMarkets
◆発行日：2019年12月19日
◆ページ数：214
◆レポート形式：PDF / 英語
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◆産業分野：半導体及び電子機器
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 【レポートの概要】

MarketsandMarkets社は、半導体製造装置の世界市場規模が2020年661億ドルから2025年1035億ドルまで年平均9.4%成長すると予測しています。当資料では、世界の半導体製造装置市場を統合的に調査・分析し、市場概要、フロントエンド装置別（リソグラフィ、ウェーハ表面調整、ウェーハ洗浄、堆積、その他のフロントエンド機器）分析、バックエンド装置別（組立およびパッケージング、ダイシング、メトロロジー、ボンディング、ウェーハ試験）分析、ファブ施設別（自動化、化学制御、ガス制御、その他）分析、製品別（メモリ、ファウンドリ、ロジック、MPU、ディスクリート、アナログ、メモリ、その他）分析、寸法別（2D、2.5D、3D）分析、サプライチェーン参加者別（IDM事務所、Osat企業、鋳造工場）分析、地域別分析、競合環境、企業概要などで構成されております。
・イントロダクション
・調査手法
・エグゼクティブサマリー
・プレミアムインサイト
・市場概要
・世界の半導体製造装置市場：フロントエンド装置別（リソグラフィ、ウェーハ表面調整、ウェーハ洗浄、堆積、その他のフロントエンド機器）
・世界の半導体製造装置市場：バックエンド装置別（組立およびパッケージング、ダイシング、メトロロジー、ボンディング、ウェーハ試験）
・世界の半導体製造装置市場：ファブ施設別（自動化、化学制御、ガス制御、その他）
・世界の半導体製造装置市場：製品別（メモリ、ファウンドリ、ロジック、MPU、ディスクリート、アナログ、メモリ、その他）
・世界の半導体製造装置市場：寸法別（2D、2.5D、3D）
・世界の半導体製造装置市場：サプライチェーン参加者別（IDM事務所、Osat企業、鋳造工場）
・世界の半導体製造装置市場：地域別
・競合環境
・企業概要

“Semiconductor manufacturing equipment market is projected to grow at CAGR of 9.4% from 2020 to 2025”
The semiconductor manufacturing equipment market is projected to grow from USD 66.1 billion in 2020 to USD 103.5 billion by 2025, at a CAGR of 9.4% from 2020 to 2025. Key factors fueling the growth of this market include the growing consumer electronics market and an increase in the number of foundries and trend of miniaturization and technology migration.

“Market for wafer surface conditioning is projected to grow at highest CAGR during forecast period among front-end equipment”
Among different types of front-end equipment, wafer surface conditioning is expected to grow at the highest CAGR from 2020 to 2025 The chemical mechanical planarization process in wafer surface conditioning has a key role, to plane the wafer surface and smoothen the wafer surface that is required to manufacture more powerful semiconductor devices. It helps in the elimination of particle impurities from the surface layer without damaging the surface structure.

“ Market for wafer testing equipment is projected to grow at highest CAGR during 2020—2025”
Among back-end equipment, the wafer testing equipment is projected to witness the highest CAGR from 2020 to 2025. Although the testing equipment is mostly focused on back-end processes, it is also used in front-end processes. These testing devices are vital for testing electronic devices for functionality and performance at different points during the semiconductor manufacturing process. With new technological development, there is an increase in the design complexities and development of new products. The increased investments in R&D and technological advancement in networking and communication devices has raised the demand for best-of-class ICs and SOCs. This need can be satisfied by enabling the investment in testing equipment for developing the best quality ICs.

“Semiconductor manufacturing equipment for memory device accounted for largest market share in 2019”
Among products, the memory segment is projected to lead the semiconductor manufacturing equipment market from 2020 to 2025. New technologies in memory, such as MRAM, ZRAM, PCRAM, and RRAM, are expected to replace most of the traditional technologies. This shift in the memory market has demanded the change in dynamics of manufacturing equipment, enforcing semiconductor manufacturing equipment providers to develop more efficient designs for the device manufacturers.

“APAC is expected to hold largest share of semiconductor manufacturing equipment market in 2025”
APAC is expected to hold the largest share of the semiconductor manufacturing equipment market in 2025. The development of semiconductor devices in Asian economies such as China, Japan, South Korea, and Taiwan drives the semiconductor equipment market. The region houses semiconductor fabrication facilities of a few of the major IDM firms such as Intel (US), Micron (US), NXP Semiconductors (Netherlands), SK Hynix (South Korea), Samsung (South Korea), and Texas Instruments (US). ASM Pacific Technology Ltd. (Singapore), SHIBUYA CORPORATION (Japan), Kulicke & Soffa (Singapore), and Shinkawa Ltd. (Japan) are among a few of the major players in this market that have headquarters in APAC. Along with these international players, the Chinese market is showing impressive growth due to the emergence of local players offering low-cost semiconductor manufacturing equipment. These factors help the semiconductor manufacturing equipment market to grow in the APAC region.

Breakdown of profiles of primary participants:
• By Company: Tier 1 = 45%, Tier 2 = 35%, and Tier 3 = 20%
• By Designation: C-level Executives = 35%, Managers = 43%, and Others (Managers, Scientists, and University Researchers) = 22%
• By Region: APAC = 38%, Americas = 37%, and EMEA = 25%

Major players profiled in this report:
• Tokyo Electron
• LAM Research
• ASML
• Applied Materials
• KLA-Tencor
• Screen Holdings
• Teradyne
• Advantest Corporation
• Hitachi High-Technologies
• Plasma-Therm

Research coverage
This report offers detailed insights into the semiconductor manufacturing equipment market based on front-end equipment, back-end equipment, fab facility equipment, product type, supply chain participant, dimension, and region. Based on front-end equipment, the semiconductor manufacturing equipment market has been segmented into lithography, wafer conditioning, deposition, cleaning, and other equipment. Based on back-end equipment, the market has been divided into assembly and packaging, dicing equipment, bonding equipment, metrology, and test/inspection equipment. Based on fab facility equipment, the market has been divided into factory automation, chemical control equipment, gas control equipment, and other equipment. Based on supply chain participants, the semiconductor manufacturing equipment market has been classified into foundry, IDM, and OSAT companies. Based on product type, the market has been divided into memory, foundry, logic, mpu, discrete, and analog, mems, and others. Based on the dimension, the semiconductor manufacturing equipment market has been classified into 2D, 2.5D, and 3D. The market has been studied for Asia Pacific (APAC); the Americas; and Europe, the Middle East, and Africa (EMEA).

Reasons to buy the report
The report is expected to help market leaders/new entrants in this market in the following ways:
1. This report segments the semiconductor manufacturing equipment market comprehensively and provides the closest approximations of the overall size of the market, as well as its segments and subsegments.
2. The report is expected to help stakeholders understand the pulse of the market and provide them with information about key drivers, restraints, challenges, and opportunities.
3. This report aims at helping stakeholders in obtaining an improved understanding of their competitors and gaining insights to enhance their position in the market. The competitive landscape section includes the competitor ecosystem of the market, as well as growth strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions adopted by major market players.

【レポートの目次】

1 Introduction (Page No. – 20)
1.1 Study Objectives
1.2 Definition
1.2.1 Inclusions and Exclusions
1.3 Scope
1.3.1 Markets Covered
1.3.2 Years Considered
1.4 Currency
1.5 Limitations
1.6 Market Stakeholders
2 Research Methodology (Page No. – 24)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Secondary Sources
2.1.2 Primary Data
2.1.2.1 Breakdown of Primary Interviews
2.1.2.2 Key Data From Primary Sources
2.1.2.3 Key Industry Insights
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.1.1 Approach for Capturing Market Size By Bottom-Up Analysis (Demand Side)
2.2.2 Top-Down Approach
2.2.2.1 Approach for Capturing Market Size By Top-Down Analysis (Supply Side)
2.3 Market Breakdown and Data Triangulation
2.4 Research Assumptions
3 Executive Summary (Page No. – 37)
4 Premium Insights (Page No. – 42)
4.1 Attractive Growth Opportunities in Semiconductor Manufacturing Equipment Market
4.2 Market, By Country
4.3 Market, By Product Type
4.4 Front-End Market, By Equipment Type and Region
5 Market Overview (Page No. – 44)
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 Increasing Investments in R&D Facilities
5.2.1.2 Increasing Demand for Electric and Hybrid Vehicles
5.2.1.3 Growing Consumer Electronics Market and Increasing Number of Foundries
5.2.1.4 Trend of Miniaturization and Technology Migration
5.2.1.5 High Demand for Chips to Provide Computation Power and Connectivity for AI Applications
5.2.2 Restraints
5.2.2.1 High Purchase and Maintenance Costs
5.2.2.2 Complexity of Patterns and Functional Defects in Manufacturing Process
5.2.3 Opportunities
5.2.3.1 Rising Demand for Silicon-Based Sensors for IoT Devices
5.2.3.2 Expanding Chip Industry in China
5.2.3.3 Growing Number of Data Centers and Servers
5.2.3.4 Developing Market for Advanced Packaging Products
5.2.4 Challenges
5.2.4.1 Technical Problems Faced During Fabrication Process
5.2.4.2 Increased Complexities Related to Miniaturized Structures of Circuits
5.3 Value Chain Analysis
6 Semiconductor Manufacturing Equipment Market, By Front-End Equipment (Page No. – 61)
6.1 Introduction
6.2 Lithography
6.2.1 DUV Lithography
6.2.1.1 I-Line, KRF, ARF Dry, and ARFI are Some of the Key Sources Used in DUV Lithography
6.2.2 Euv Lithography
6.2.2.1 EUVL Designs Triple Or Even Quadruple Patterning at 10 Nm and
7 Nm Nodes and is Expected to Achieve 5 Nm Nodes (Page No. – 67)
6.3 Wafer Surface Conditioning
6.3.1 Etching
6.3.1.1 Piranha Etch, Potassium Hydroxide (Koh)Etch, and Silicon Nitride Etch are Some of the Key Wet Etching Techniques
6.3.2 Chemical Mechanical Planarization
6.3.2.1 CMP Plays A Crucial Role in Removing Unwanted Conductive Or Dielectric Materials on Silicon Wafers
6.4 Wafer Cleaning
6.4.1 Single-Wafer Spray System
6.4.1.1 Single-Wafer Spray System is an Effective Cleaning Technique With Minimal Damage
6.4.2 Single-Wafer Cryogenic System
6.4.2.1 Single-Wafer Cryogenic System is an Effective Technique in Post–Chemical Mechanical Polishing (CMP) Cleaning Processes
6.4.3 Batch Immersion Cleaning System
6.4.3.1 Batch Immersion Cleaning System is the Most Cost-Effective and Time-Saving Systems
6.4.4 Batch Spray Cleaning System
6.4.4.1 Batch Spray Cleaning System Can Process Large Batches With High Throughput Or Small Batches With Short Cycle Times
6.4.5 Scrubber
6.4.5.1 Scrubbers are One of the Most Commonly Used Tools for Mechanical Cleaning of Wafers
6.5 Deposition
6.5.1 Pvd
6.5.1.1 Pvd is A Commonly Used Deposition Technique for Low Accuracy Films
6.5.2 Cvd
6.5.2.1 Cvd is the Key Technique Used for Production of Thin Films and Complex Layered Micro- and Nano-Structures
6.6 Other Front-End Equipment
7 Semiconductor Manufacturing Equipment Market, By Back-End Equipment (Page No. – 83)
7.1 Introduction
7.2 Assembly and Packaging
7.2.1 Osat Companies are Contributing Significantly to the Growth of Assembly and Packaging Equipment Segment
7.3 Dicing
7.3.1 Plasma Dicing is Better Than Conventional Blade and Laser Dicing
7.4 Metrology
7.4.1 Growth in Automation has Led to Increased Penetration of Metrology Equipment to Reduce Defects
7.5 Bonding
7.5.1 3D Semiconductor Assembly and Packaging are Key Growth Factors for Bonding Equipment Segment
7.6 Wafer Testing
7.6.1 Rising Demand for High-Quality Electronic Products has Raised the Need for Testing Equipment During Fabrication and Assembly
8 Semiconductor Manufacturing Equipment Market, By Fab Facility (Page No. – 101)
8.1 Introduction
8.2 Automation
8.2.1 Automation Equipment Help in Resolving Complexities in Processes, Minimizing Waste, Reducing Costs, and Planning and Utilizing Resources Optimally
8.3 Chemical Control
8.3.1 Chemical Control Equipment Provide Controlled, Repeated, and Reliable Delivery of Chemicals in Semiconductor Manufacturing Process
8.4 Gas Control
8.4.1 Gas Control Equipment Play A Key Role in Providing Precisely Controlled Mix of Gases in Wafer Manufacturing Process
8.5 Others
8.5.1 Probing Machines are Majorly Used to Perform Electric Tests of Chips
9 Semiconductor Manufacturing Equipment Market, By Product Type (Page No. – 107)
9.1 Introduction
9.2 Memory
9.2.1 Shift in Memory Market Leads to Demand for Advanced Semiconductor Manufacturing Equipment
9.3 Foundry
9.3.1 Pure-Play Foundries Expected to Witness Strong Growth Due to Contracts From Fabless Players
9.4 Logic
9.4.1 Logic Devices are Critical Components in Electronic Circuits That Operate as Per Defined Programs
9.5 MPU
9.5.1 Extensive Use of MPUs in Many Consumer Electronics Expected to Boost Their Demand During Forecast Period
9.6 Discrete
9.6.1 Demand for Discrete Components is Driven By Their Role of Being A Base of Any Electronic Circuit
9.7 Analog, Mems, and Other
9.7.1 Growth of Mems is Attributed to Demand From Consumer Electronics
10 Semiconductor Manufacturing Equipment Market, By Dimension (Page No. – 119)
10.1 Introduction
10.2 2D
10.2.1 2D IC Technology is Used in Several Conventional High-End Applications Such as Smartphones and Tablets
10.3 2.5D
10.3.1 Use of Silicon Interposers on 2.5D ICs is an Incremental Step to Increase Capacity and Performance of Semiconductor Devices
10.4 3D
10.4.1 Need for Improved Electrical Performance Expected to Increase Demand for 3D ICs
11 Semiconductor Manufacturing Equipment Market, By Supply Chain Participant (Page No. – 125)
11.1 Introduction
11.2 IDM Firms
11.2.1 IDM Firms Rapidly Adopt Innovative Technologies and are Expected to Lead Market During Forecast Period
11.3 Osat Companies
11.3.1 Osat Companies to Play Significant Role Owing to Challenges Faced By Foundries Related to Assembly and Packaging
11.4 Foundries
11.4.1 Foundries have Dominance in APAC Region Owing to Presence of Major Players
12 Semiconductor Manufacturing Equipment Market, By Region (Page No. – 130)
12.1 Introduction
12.2 Americas
12.2.1 US
12.2.1.1 US Expected to Lead Market in Americas
12.2.2 Canada
12.2.2.1 Government Initiatives in the Country are Expected to Drive Market
12.2.3 Rest of Americas
12.2.3.1 Increasing Demand for IoT and 5G Surges the Need for Semiconductor Manufacturing Equipment in Rest of Americas
12.3 EMEA
12.3.1 Germany
12.3.1.1 Growth in Smart Homes and Connected Cars to Boost Demand for Semiconductor Manufacturing Equipment in Germany
12.3.2 UK
12.3.2.1 Growth in Communication Network and Increasing Collaboration to Spur Market in UK
12.3.3 Ireland
12.3.3.1 Presence of Intel Fab is the Key Reason for Market Growth in Ireland
12.3.4 France
12.3.4.1 Developed Communication Network has Prompted Market Growth in France
12.3.5 Italy
12.3.5.1 Enhancements in Technologies By Players Such as Stmicroelectronics Surge the Growth of Market in Italy
12.3.6 Rest of EMEA
12.3.6.1 Rest of EMEA is Home to Giant Players for Advanced Lithography and Next-Generation Packaging Equipment
12.4 APAC
12.4.1 South Korea
12.4.1.1 High Manufacturing Capability to Drive South Korean Market
12.4.2 China
12.4.2.1 Market in China to Grow at Highest Rate in APAC
12.4.3 Taiwan
12.4.3.1 Presence of Many Key Osat Companies Drives Market Growth in Taiwan
12.4.4 Japan
12.4.4.1 Increasing Demand for Vehicles and Consumer Electronics and Expanding Presence of Market Players in Country Fuel Market Growth in Japan
12.4.5 Rest of APAC
12.4.5.1 Presence of Fabrication Plants and Rising Consumer Electronics Demand to Drive Market in Rest of APAC
13 Competitive Landscape (Page No. – 151)
13.1 Overview
13.2 Key Players in Semiconductor Manufacturing Equipment Market
13.3 Competitive Leadership Mapping
13.3.1 Visionary Leaders
13.3.2 Innovators
13.3.3 Dynamic Differentiators
13.3.4 Emerging Companies
13.4 Strength of Product Portfolio (For 25 Companies)
13.5 Business Strategy Excellence (For 25 Companies)
13.6 Competitive Scenario
13.6.1 Product Launches & Developments
13.6.2 Partnerships, Collaborations, and Agreements
13.6.3 Mergers & Acquisitions and Expansions
14 Company Profiles (Page No. – 163)
(Business Overview, Products, Solutions, Services, & Technologies Offered, Recent Developments, SWOT Analysis, and MnM View)*
14.1 Introduction
14.2 Key Players
14.2.1 Tokyo Electron (TEL)
14.2.2 LAM Research
14.2.3 ASML
14.2.4 Applied Materials
14.2.5 Kla-Tencor
14.2.6 Screen Holdings
14.2.7 Teradyne
14.2.8 Advantest
14.2.9 Hitachi High-Technologies Corporation
14.2.10 Plasma-Therm
14.3 Right-To-Win (Key Market Players)
14.4 Other Companies
14.4.1 Rudolph Technologies
14.4.2 Veeco Instruments
14.4.3 EV Group
14.4.4 Nanometrics
14.4.5 Nordson
14.4.6 Advanced Dicing Technologies
14.4.7 Quik-Pak
14.4.8 Evatec
14.4.9 Noivion
14.4.10 Semiconductor Equipment Corporation
*Details on Business Overview, Products, Solutions, Services, & Technologies Offered, Recent Developments, SWOT Analysis, and MnM View Might Not Be Captured in Case of Unlisted Companies.
15 Appendix (Page No. – 206)
15.1 Discussion Guide
15.2 Knowledge Store: Marketsandmarkets’ Subscription Portal
15.3 Available Customizations
15.4 Related Reports
15.5 Author Details

List of Tables (106 Tables)
Table 1 Front-End Semiconductor Manufacturing Equipment Market, By Type, 2017–2025 (USD Billion)
Table 2 Front-End Market, By Region 2017–2025 (USD Billion)
Table 3 Front-End Market in Americas, By Country, 2017–2025 (USD Million)
Table 4 Front-End Market in EMEA, By Country, 2017–2025 (USD Million)
Table 5 Front-End Market in APAC, By Country, 2017–2025 (USD Billion)
Table 6 Front-End Market, By Product Type, 2017–2025 (USD Billion)
Table 7 Lithography Equipment Market, 2017–2025 (Million Units)
Table 8 Lithography Equipment Market, By Region, 2017–2025 (USD Billion)
Table 9 Lithography Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 10 Lithography Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 11 Lithography Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 12 Wafer Surface Conditioning Equipment Market, By Type, 2017–2025 (USD Million)
Table 13 Wafer Conditioning Equipment Market, By Region, 2017–2025 (USD Billion)
Table 14 Wafer Conditioning Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 15 Wafer Conditioning Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 16 Wafer Conditioning Equipment Market, By APAC, 2017–2025 (USD Million)
Table 17 Etching Wafer Conditioning Equipment Market, By Region, 2017–2025 (USD Billion)
Table 18 CMP Wafer Conditioning Equipment Market, By Region, 2017–2025 (USD Billion)
Table 19 Wafer Cleaning Equipment Market, By Region, 2017–2025 (USD Million)
Table 20 Wafer Cleaning Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 21 Wafer Cleaning Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 22 Wafer Cleaning Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 23 Deposition Equipment Market, By Region, 2017–2025 (USD Billion)
Table 24 Deposition Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 25 Deposition Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 26 Deposition Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 27 Other Front-End Equipment Market, By Region, 2017–2025 (USD Billion)
Table 28 Other Front-End Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 29 Other Front-End Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 30 Other Front-End Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 31 Back-End Market, By Type, 2017–2025 (USD Million)
Table 32 Back-End Market, By Region, 2017–2025 (USD Billion)
Table 33 Back-End Market in Americas, By Country, 2017–2025 (USD Million)
Table 34 Back-End Market in EMEA, By Country, 2017–2025 (USD Million)
Table 35 Back-End Market in APAC, By Country, 2017–2025 (USD Million)
Table 36 Back-End Market, By Product Type, 2017–2025 (USD Million)
Table 37 Assembly and Packaging Equipment Market, By Region, 2017–2025 (USD Million)
Table 38 Assembly and Packaging Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 39 Assembly and Packaging Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 40 Assembly and Packaging Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 41 Dicing Equipment Market, By Region, 2017–2025 (USD Million)
Table 42 Dicing Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 43 Dicing Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 44 Dicing Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 45 Metrology Equipment Market, By Region, 2017–2025 (USD Million)
Table 46 Metrology Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 47 Metrology Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 48 Metrology Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 49 Bonding Equipment Market, By Region, 2017–2025 (USD Million)
Table 50 Bonding Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 51 Bonding Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 52 Bonding Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 53 Wafer Testing Equipment Market, By Region, 2017–2025 (USD Million)
Table 54 Wafer Testing Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 55 Wafer Testing Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 56 Wafer Testing Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 57 Market, By Fab Facility Equipment, 2017–2025 (USD Million)
Table 58 Fab Facility Equipment Market, By Region, 2017–2025 (USD Billion)
Table 59 Fab Facility Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 60 Fab Facility Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 61 Fab Facility Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 62 Fab Facility Equipment Market, By Product Type, 2017–2025 (USD Million)
Table 63 Semiconductor Manufacturing Equipment Market, By Product, 2017–2025 (USD Billion)
Table 64 Market for Memory, By Equipment Type, 2017–2025 (USD Billion)
Table 65 Market for Memory, By Region, 2017–2025 (USD Billion)
Table 66 Market for Foundry, By Equipment Type, 2017–2025 (USD Billion)
Table 67 Market for Foundry, By Region, 2017–2025 (USD Billion)
Table 68 Market for Logic, By Equipment Type, 2017–2025 (USD Million)
Table 69 Market for Logic, By Region, 2017–2025 (USD Million)
Table 70 Market for MPU, By Equipment Type, 2017–2025 (USD Million)
Table 71 Market for MPU, By Region, 2017–2025 (USD Million)
Table 72 Market for Discrete Products, By Equipment Type, 2017–2025 (USD Million)
Table 73 Market for Discrete Products, By Region, 2017–2025 (USD Million)
Table 74 Market for Analog, Mems, and Other Products, By Equipment Type, 2017–2025 (USD Million)
Table 75 Market for Analog, Mems, and Other Products, By Region, 2017–2025 (USD Million)
Table 76 Market, By Dimension, 2017–2025 (USD Billion)
Table 77 Comparison Between 2D, 2.5D, and 3D IC Technologies
Table 78 Market for 2D IC, By Region, 2017–2025 (USD Billion)
Table 79 Market for 2.5D IC, By Region, 2017–2025 (USD Billion)
Table 80 Market for 3D IC, By Region, 2017–2025 (USD Million)
Table 81 Market, By Supply Chain Participant, 2017–2025 (USD Billion)
Table 82 Market for IDM Firms, By Region, 2017–2025 (USD Billion)
Table 83 Market for Osat Companies, By Region, 2017–2025 (USD Billion)
Table 84 Market for Foundries, By Region, 2017–2025 (USD Billion)
Table 85 Market, By Region, 2017–2025 (USD Billion)
Table 86 Market in Americas, By Equipment, 2017–2025 (USD Billion)
Table 87 Market in Americas, By Front-End Equipment, 2017–2025 (USD Billion)
Table 88 Market in Americas, By Back-End Equipment, 2017–2025 (USD Million)
Table 89 Market in Americas, By Fab Facility Equipment, 2017–2025 (USD Million)
Table 90 Market in Americas, By Dimension, 2017–2025 (USD Million)
Table 91 Market in Americas, By Country, 2017–2025 (USD Million)
Table 92 Market in EMEA, By Equipment, 2017–2025 (USD Billion)
Table 93 Market in EMEA, By Front-End Equipment, 2017–2025 (USD Billion)
Table 94 Market in EMEA, By Back-End Equipment, 2017–2025 (USD Million)
Table 95 Market in EMEA, By Fab Facility Equipment, 2017–2025 (USD Million)
Table 96 Market in EMEA, By Dimension, 2017–2025 (USD Million)
Table 97 Market in EMEA, By Country, 2017–2025 (USD Million)
Table 98 Market in APAC, By Equipment, 2017–2025 (USD Billion)
Table 99 Market in APAC, By Front-End Equipment, 2017–2025 (USD Billion)
Table 100 Market in APAC, By Back-End Equipment, 2017–2025 (USD Million)
Table 101 Market in APAC, By Fab Facility Equipment, 2017–2025 (USD Million)
Table 102 Market in APAC, By Dimension, 2017–2025 (USD Billion)
Table 103 Market in APAC, By Country, 2017–2025 (USD Billion)
Table 104 Top 10 Product Launches & Developments, January 2015–October 2019
Table 105 Top 10 Partnerships, Collaborations, and Agreements, January 2015–October 2019
Table 106 Top 10 Mergers & Acquisitions and Expansions, January 2015–October 2019

List of Figures (68 Figures)
Figure 1 Semiconductor Manufacturing Equipment Market: Research Design
Figure 2 Market Size Estimation Methodology: Approach 1 (Supply Side)— Revenue of Companies in Semiconductor Manufacturing Equipment Market
Figure 3 Market Size Estimation Methodology: Approach 2 Bottom-Up (Supply Side)—Illustration of Revenue Estimation of Semiconductor Manufacturing Equipment Companies
Figure 4 Market Size Estimation Methodology: Approach 3 – Bottom-Up (Demand Side)—Supply Chain Participants Covered Under Semiconductor Manufacturing Equipment Market
Figure 5 Market Size Estimation Methodology: Approach 4—Bottom-Up Market Estimation for Semiconductor Manufacturing Equipment, By Type
Figure 6 Market Size Estimation Methodology: Bottom-Up Approach
Figure 7 Market Size Estimation Methodology: Top-Down Approach
Figure 8 Data Triangulation
Figure 9 3D Segment Expected to Grow at Highest CAGR During Forecast Period
Figure 10 IDM Firms to Grow at Highest Rate in Market During Forecast Period
Figure 11 Lithography Equipment to Witness Highest Demand in Market During Forecast Period
Figure 12 Wafer Testing Expected to Witness Highest Growth Between 2020 and 2025
Figure 13 APAC to Hold Largest Market Share in 2019
Figure 14 Increasing Demand for Miniaturized Devices in Consumer Electronics and Automotive Industries to Spur Market Growth During Forecast Period
Figure 15 China to Record Highest CAGR in Overall Market During Forecast Period
Figure 16 Memory to Account for Largest Share of Market Till 2025
Figure 17 Lithography and APAC Likely to Be Largest Shareholders in Overall Front-End Market in 2025
Figure 18 Semiconductor Manufacturing Equipment Market Dynamics
Figure 19 Electric Vehicle Sales, 2013–2018 (Million Units)
Figure 20 Comparison of Dram Processing Steps Per Layer, By Lithography Technology
Figure 21 Expanding Applications of Artificial Intelligence (Ai)
Figure 22 Market Drivers and Their Impact
Figure 23 Market Restraints and Their Impact
Figure 24 Presence of Domestic Chinese Companies in Different Semiconductor Manufacturing Equipment
Figure 25 Market Opportunities and Their Impact
Figure 26 Market Challenges and Their Impact
Figure 27 Value Chain Analysis of Semiconductor Manufacturing Equipment Market
Figure 28 Value Chain Analysis of Front-End Semiconductor Manufacturing Equipment Ecosystem
Figure 29 Value Chain Analysis of Back-End Semiconductor Manufacturing Equipment Ecosystem
Figure 30 Lithography Equipment Accounts for Largest Market Share Among All Equipment Types
Figure 31 APAC Accounts for Largest Share of Lithography Equipment Market
Figure 32 CMP Market Expected to Grow at Highest CAGR During Forecast Period
Figure 33 APAC Market for Cleaning Equipment Expected to Grow at Highest CAGR During Forecast Period
Figure 34 APAC Market to Hold Largest Share of Deposition Equipment Market During Forecast Period
Figure 35 Wafer Testing is Expected to Hold Largest Share of Back-End Equipment Market During Forecast Period
Figure 36 APAC is Expected to Hold Largest Share of Assembly and Packaging Equipment Market During Forecast Period
Figure 37 Dicing Equipment Market in APAC to Grow at Highest CAGR During Forecast Period
Figure 38 APAC to Hold Largest Share of Metrology Equipment Market During Forecast Period
Figure 39 Bonding Equipment Market in APAC to Grow at Highest CAGR During Forecast Period
Figure 40 Wafer Testing Equipment Market in APAC to Grow at Highest CAGR During Forecast Period
Figure 41 Chemical Control Equipment to Grow at Highest CAGR During Forecast Period
Figure 42 Memory Accounts for Largest Share of Market Among All Product Types
Figure 43 APAC Accounts for Largest Share of Market for Memory
Figure 44 APAC Accounts for Largest Share of Market for Foundry
Figure 45 APAC Accounts for Largest Share of Market for Logic
Figure 46 APAC Accounts for Largest Share of Market for MPU
Figure 47 APAC Accounts for Largest Share of Market for Discrete Products
Figure 48 APAC Accounts for Largest Share of Market for Analog, Mems, and Other Products Segment
Figure 49 Market for 3D ICs to Grow at Highest CAGR During Forecast Period
Figure 50 Semiconductor Manufacturing Equipment Market, By Supply Chain Participant
Figure 51 IDM Firms Account for Largest Share of Market
Figure 52 Market in APAC to Grow at Highest CAGR During Forecast Period
Figure 53 Americas: Semiconductor Manufacturing Equipment Snapshot
Figure 54 EMEA: Semiconductor Manufacturing Equipment Snapshot
Figure 55 APAC: Semiconductor Manufacturing Equipment Snapshot
Figure 56 Companies Adopted Product Launches & Developments as Key Growth Strategy From January 2015 to October 2019
Figure 57 Market: Company Ranking Analysis (2018)
Figure 58 Market (Global) Competitive Leadership Mapping, 2018
Figure 59 Tokyo Electron: Company Snapshot
Figure 60 LAM Research: Company Snapshot
Figure 61 ASML: Company Snapshot
Figure 62 Applied Materials: Company Snapshot
Figure 63 Kla-Tencor: Company Snapshot
Figure 64 Screen Holdings: Company Snapshot
Figure 65 Teradyne: Company Snapshot
Figure 66 Advantest: Company Snapshot
Figure 67 Hitachi High-Technologies Corporation: Company Snapshot
Figure 68 Plasma-Therm: Company Snapshot

★調査レポート[世界の半導体製造装置市場：フロントエンド装置別（リソグラフィー、ウェーハ表面調整、堆積）、バックエンド装置別、製造施設機器別、製品種類別、寸法別、サプライチェーン参加者別、地域別] ( Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Deposition), Back-end Equipment, Fab Facility Equipment, Product Type, Dimension, Supply Chain Participant, Region - Global Forecast to 2025 / SE 5344) 販売に関する免責事項
[世界の半導体製造装置市場：フロントエンド装置別（リソグラフィー、ウェーハ表面調整、堆積）、バックエンド装置別、製造施設機器別、製品種類別、寸法別、サプライチェーン参加者別、地域別] ( Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Deposition), Back-end Equipment, Fab Facility Equipment, Product Type, Dimension, Supply Chain Participant, Region - Global Forecast to 2025 / SE 5344) についてEメールでお問い合わせ

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