Substrate-Like PCB Market by Line/Spacing (25/25 & 30/30 µm and Less than 25/25 µm), Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2024

サブストレートライクPCB(SLP)の世界市場予測(~2024年)

◆タイトル:Substrate-Like PCB Market by Line/Spacing (25/25 & 30/30 µm and Less than 25/25 µm), Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2024
◆商品コード:SE 6851
◆調査・発行会社:MarketsandMarkets
◆発行日:2019年1月11日
◆ページ数:121
◆レポート形式:PDF / 英語
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル
◆産業分野:半導体・電子
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【レポートの概要】

サブストレートライクPCB(SLP)の世界市場は、2018年の11億米ドルから2024年には26億米ドルに達し、この期間中15.6%の年平均成長率で成長すると予測されています。この市場の成長を促す要因として、大手OEMによる高いSLP採用率、スマート家電およびウェアラブル機器に対する需要の急増、影響力のあるSLPの利点などが考えられます。一方で、SLPに関連するセットアップ費用が高額になることにより、市場の成長が抑制される可能性があります。当調査レポートでは、サブストレートライクPCB(SLP)の世界市場について調査・分析し、エグゼクティブサマリー、市場インサイト、市場概観/市場動向、ライン・スペーシング別(25/25・30/30μm、25/25μm以下)分析、検査技術(自動光学検査、ダイレクトイメージング、光学式自動シェイピング)分析、用途別分析、サブストレートライクPCB(SLP)の世界市場規模及び予測、市場動向、競争状況、関連企業分析などの情報をお届けいたします。

“High adoption of SLP by leading OEMs to drive overall growth of substrate-like PCB market”
The substrate-like PCB market is expected to grow from USD 1.1 billion in 2018 to USD 2.6 billion by 2024, at a compound annual growth rate (CAGR) of 15.6% during the forecast period. The substrate-like PCB market is driven by various factors, such as the high adoption of SLPs by leading OEMs, the surge in demand for smart consumer electronics and wearable devices, and impactful benefits of SLPs. However, higher setup costs associated with SLPs can hinder the growth of the market.

“Based on line/space, less than 25/25 µm line/space to witness highest CAGR during forecast period”
The line spacing of the copper track embedded into the PCB is important as it is directly related to the size of the PCB and eventually the size of the product. As miniaturization of the product has become an important factor in applications such as consumer electronics, medical, and computing and communications, the line spacing is expected to decrease further. With modified semi-additive method (mSAP), manufacturing smaller size PCBs can be achieved by reducing the track width, which ultimately makes it possible to have more number of electrical connections on the same area of the PCB. The PCB industry is striving continuously to improve the mSAP process capability and achieve unprecedented densities, which, in turn, helps fabricators to offer SLPs with line/space of less than 25/25 µm.
“Based on inspection technologies, automated optical shaping to grow at highest CAGR during forecast period”
AOS technology helps to remove excess copper and complete PCB tracks (patterns) on the SLP board where copper is missing. With this technology, PCB manufacturers can benefit from common problems observed on PCB boards such as short tracks and open tracks as this technology has the potential to remove the short tracks and connect the open tracks automatically. Due to the additional benefits of AOS as compared to other inspection technologies, it is expected that AOS will grow at the highest CAGR during the forecast period.

“APAC to record highest growth rate during forecast period”

APAC is an emerging market for substrate-like PCBs. APAC has become a global focal point for large investments and business expansion opportunities. More than 50% of the global mobile subscribers live in APAC—mostly in China and India. There has been a paradigm shift of users from 3G to 4G technology in this region. Key factors that drive the SLP market growth in APAC include the increasing adoption of smartphones, a growing number of internet users, rising demand for connectivity solutions, expansion of telecommunications infrastructure, and expanding bandwidth-intensive applications in the region. As most of the smartphone providers are from the APAC region, it is expected that there would be a major demand for SLP in the APAC region during the forecast period. Taiwan has become one of the center places for the development of SLP technology.

In-depth interviews were conducted with chief executive officers (CEOs), marketing directors, other innovation and technology directors, and executives from various key organizations operating in the substrate-like PCB marketplace.

• By Company Type: Tier 1 = 35%, Tier 2 =45%, and Tier 3 = 20%
• By Designation: C-Level Executives = 35%, Directors = 25%, and Others = 40%
• By Region: North America = 30%, Europe = 20%, APAC = 45%, RoW = 5%

The substrate-like PCB market comprises major players, namely, AT & S (Austria); TTM Technologies (US); Samsung Electro-Mechanics (South Korea); Korea Circuit (South Korea); Kinsus Interconnect Technology (Taiwan); Zhen Ding Technology (Taiwan); Unimicron (Taiwan); Compeq (Taiwan); Ibiden (Japan); Daeduck (South Korea); ISU Petasys (South Korea); Tripod Technology Corporation (Taiwan); and LG Innotek (South Korea).
The study includes an in-depth competitive analysis of these key players in the substrate-like PCB market, with their company profiles, recent developments, and key market strategies.

Research Coverage:

The report defines, describes, and forecasts the substrate-like PCB market based on line/space, inspection technologies, application, and geography. It provides detailed information regarding the major factors (drivers, restraints, opportunities, and challenges) influencing the growth of the substrate-like PCB market. It also analyzes the competitive developments such as joint ventures, collaborations, agreements, contracts, partnerships, mergers and acquisitions, and product launches carried out by the key players to grow in the market.

Key Benefits of Buying the Report

The report will help the market leaders/new entrants in this market with information on the closest approximations of the revenue numbers for the overall substrate-like PCB market and the subsegments. This report will help stakeholders understand the competitive landscape and gain more insights to better position their businesses and to plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.

【レポートの目次】

TABLE OF CONTENTS

1 INTRODUCTION 14
1.1 STUDY OBJECTIVES 14
1.2 DEFINITION 14
1.3 STUDY SCOPE 15
1.3.1 MARKETS COVERED 15
1.4 YEARS CONSIDERED 15
1.5 CURRENCY 16
1.6 STAKEHOLDERS 16
2 RESEARCH METHODOLOGY 17
2.1 RESEARCH DATA 17
2.1.1 SECONDARY DATA 19
2.1.1.1 Key data from secondary sources 19
2.1.2 PRIMARY DATA 19
2.1.2.1 Primary interviews with experts 20
2.1.2.2 Breakdown of primaries 20
2.1.2.3 Key data from primary sources 21
2.1.2.4 Key industry insights 22
2.2 MARKET SIZE ESTIMATION 22
2.2.1 BOTTOM-UP APPROACH 22
2.2.1.1 Approach for capturing market size by bottom-up analysis
(demand side) 23
2.2.2 TOP-DOWN APPROACH 24
2.2.2.1 Approach for capturing market size by top-down analysis
(supply side) 24
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 26
2.4 RESEARCH ASSUMPTIONS 27
3 EXECUTIVE SUMMARY 28
4 PREMIUM INSIGHTS 31
4.1 ATTRACTIVE OPPORTUNITIES IN SUBSTRATE-LIKE PCB MARKET 31
4.2 SUBSTRATE LIKE PCB MARKET IN APAC, BY APPLICATION AND COUNTRY 32
4.3 COUNTRY-WISE SUBSTRATE-LIKE PCB MARKET GROWTH RATE 33
5 MARKET OVERVIEW 34
5.1 INTRODUCTION 34
5.2 MARKET DYNAMICS 34
5.2.1 DRIVERS 35
5.2.1.1 High adoption of SLPs by leading OEMs 35
5.2.1.2 Surge in demand for smart consumer electronics and wearable devices 35
5.2.1.3 Impactful benefits of SLPs 35
5.2.2 RESTRAINTS 36
5.2.2.1 Higher setup costs associated with SLPs 36
5.2.3 OPPORTUNITIES 36
5.2.3.1 Increasing use of advanced printed circuit boards in high-end technology-based products 36
5.2.3.2 Rising adoption of SLP technology by smartphone players owing to transition from 4G to 5G technology 36
5.2.3.3 Growing use of mSAP and SAP processes in PCB manufacturing 37
5.2.4 CHALLENGES 37
5.2.4.1 Increasing complexity of printed circuit boards 37
6 SUBSTRATE-LIKE PCB MARKET, BY LINE/SPACE 38
6.1 INTRODUCTION 39
6.2 25/25µM AND 30/30µM LINE/SPACE 40
6.2.1 25/25µM & 30/30µM LINE/SPACE SEGMENT DOMINATE SLP MARKET, IN TERMS OF SIZE, OWING TO THE RISING ADOPTION OF MINIATURE DEVICES 40
6.3 LESS THAN 25/25 µM LINE/SPACE 42
6.3.1 SUBSTANTIAL GROWTH RATE OF MARKET FOR SLPS WITH LESS THAN 25/25 µM LINE/SPACE DUE TO ADOPTION OF ADDITIVE PROCESS IN MANUFACTURING THESE SLPS 42
7 SUBSTRATE-LIKE PCB MARKET, BY APPLICATION 45
7.1 INTRODUCTION 46
7.2 CONSUMER ELECTRONICS 48
7.2.1 CONSUMER ELECTRONICS EXPECTED TO HOLD LARGEST SIZE OF SLP MARKET OWING TO ADOPTION OF SLP BY LEADING ORIGINAL EQUIPMENT MANUFACTURERS IN THEIR SMARTPHONES 48
7.3 COMPUTING AND COMMUNICATIONS 49
7.3.1 INCREASING ADOPTION OF ADVANCED COMMUNICATION TECHNOLOGIES WOULD LEAD TO HIGH DEMAND FOR SLP FOR COMPUTING AND COMMUNICATIONS APPLICATIONS 49
7.4 AUTOMOTIVE 51
7.4.1 INCREASING DEMAND FOR MULTILAYER PRINTED CIRCUIT BOARDS IN AUTOMOTIVE ELECTRONICS WILL SPUR SLP MARKET GROWTH 51
7.5 MEDICAL 53
7.5.1 RISING TREND OF MINIATURIZATION OF ADVANCED MEDICAL EQUIPMENT AND DEVICES EXPECTED TO PROVIDE OPPORTUNITIES FOR SLP MARKET PLAYERS 53
7.6 INDUSTRIAL 55
7.6.1 GROWING TREND OF IIOT AND INDUSTRY 4.0 TO DRIVE DEMAND FOR SLP IN INDUSTRIAL APPLICATIONS 55

7.7 MILITARY, DEFENSE, AND AEROSPACE 56
7.7.1 NORTH AMERICA TO LEAD SLP MARKET FOR MILITARY, DEFENSE AND AEROSPACE APPLICATIONS DUE TO INCREASING DEMAND FOR
HIGH-PERFORMANCE PRINTED CIRCUIT BOARDS 56
8 SUBSTRATE-LIKE PCB MARKET, BY INSPECTION TECHNOLOGY 59
8.1 INTRODUCTION 60
8.2 AUTOMATED OPTICAL INSPECTION (AOI) 62
8.2.1 AOI TECHNOLOGY TO HOLD LARGEST SHARE OF SLP MARKET OWING TO INCREASED INTEREST OF SLP MANUFACTURERS IN ADOPTING ADVANCED INSPECTION TECHNOLOGIES 62
8.3 DIRECT IMAGING (DI) OR LASER DIRECT IMAGING (LDI) 64
8.3.1 STURDY GROWTH OF DI IN SLP MARKET BASED ON INSPECTION TECHNOLOGY AS IT OFFERS OPTIMAL QUALITY AT HIGH SPEED 64
8.4 AUTOMATED OPTICAL SHAPING (AOS) 65
8.4.1 SLP MARKET FOR AOS TECHNOLOGY TO GROW AT HIGHEST CAGR DUE TO ITS HIGH POTENTIAL FOR FINDINGS FAULTS AND SHAPING COPPER TRACKS 65
9 GEOGRAPHIC ANALYSIS 67
9.1 INTRODUCTION 68
9.2 NORTH AMERICA 69
9.2.1 US 71
9.2.1.1 High adoption of SLPs in consumer electronics applications to boost market growth in US 71
9.2.2 CANADA 72
9.2.2.1 Automotive and healthcare segments expected to provide opportunity for SLP market 72
9.2.3 MEXICO 72
9.2.3.1 Mexican market expected to grow at steady rate due to increasing government initiatives in industrial sector 72
9.3 EUROPE 73
9.3.1 GERMANY 75
9.3.1.1 Germany expected to dominate European SLP market owing to growing automotive industry in country 75
9.3.2 UK 76
9.3.2.1 Increasing importance of smart manufacturing would augment SLP market growth in UK 76
9.3.3 FRANCE 76
9.3.3.1 Steady market growth in France owing to rising demand for SLPs in computing and communications applications 76
9.3.4 ITALY 76
9.3.4.1 Strong market growth in Italy owing to high adoption of SLPs by manufacturers of premium cars 76
9.3.5 REST OF EUROPE 76

9.4 ASIA PACIFIC 77
9.4.1 CHINA 80
9.4.1.1 China would witness highest growth rate in SLP market in APAC due to rising demand for consumer electronics in the country 80
9.4.2 JAPAN 81
9.4.2.1 Growth of SLP market in Japan will be driven by rising adoption of SLPs in communications, automotive, and medical applications 81
9.4.3 SOUTH KOREA 81
9.4.3.1 SLP market in South Korea would grow due to presence of OEMs such as Samsung in country 81
9.4.4 TAIWAN 82
9.4.4.1 Taiwan has strong presence of PCB providers who are likely to enter in SLP market 82
9.4.5 REST OF APAC 82
9.5 ROW 82
9.5.1 MIDDLE EAST AND AFRICA 83
9.5.1.1 SLP market growth in Middle East and Africa would be driven by rising adoption of SLPs in computing and communications applications 83
9.5.2 SOUTH AMERICA 84
9.5.2.1 South American market to witness highest CAGR in substrate-like PCB market in RoW 84
10 COMPETITIVE LANDSCAPE 85
10.1 OVERVIEW 85
10.2 RANKING ANALYSIS OF MARKET PLAYERS 86
10.2.1 PRODUCT LAUNCHES/DEVELOPMENTS 87
10.2.2 AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND CONTRACTS 87
10.2.3 ACQUISITIONS 88
10.2.4 EXPANSIONS 88
11 COMPANY PROFILES 89
11.1 OVERVIEW 89
11.2 KEY PLAYERS 90
(Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View)*
11.2.1 KINSUS INTERCONNECT TECHNOLOGY 90
11.2.2 IBIDEN 93
11.2.3 COMPEQ 95
11.2.4 UNIMICRON 97
11.2.5 AT&S 100
11.2.6 TTM TECHNOLOGIES 103
11.2.7 SAMSUNG ELECTRO-MECHANICS 106

11.2.8 KOREA CIRCUIT 108
11.2.9 ZHEN DING TECHNOLOGY 110
* Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View might not be captured in case of unlisted companies.
11.3 OTHER PLAYERS 112
11.3.1 DAEDUCK GDS COMPANY 112
11.3.2 ISU PETASYS 112
11.3.3 TRIPOD TECHNOLOGY CORP 113
11.3.4 LG INNOTEK 113
12 APPENDIX 114
12.1 DISCUSSION GUIDE 114
12.2 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 117
12.3 RELATED REPORTS 119
12.4 AUTHOR DETAILS 120

LIST OF TABLES

TABLE 1 SUBSTRATE-LIKE PCB MARKET, BY LINE/SPACE, 2017–2024 (USD MILLION) 40
TABLE 2 SUBSTRATE LIKE PCB MARKET FOR 25/25 AND 30/30 µM LINE/SPACE,
BY INSPECTION TECHNOLOGY, 2017–2024 (USD MILLION) 41
TABLE 3 SLP MARKET FOR 25/25 AND 30/30 µM LINE/SPACE, BY APPLICATION,
2017–2024 (USD MILLION) 42
TABLE 4 SUBSTRATE-LIKE PCB MARKET FOR LESS THAN 25/25 LINE/SPACE,
BY INSPECTION TECHNOLOGY, 2020–2024 (USD MILLION) 43
TABLE 5 SLP MARKET FOR LESS THAN 25/25 µM LINE/SPACE, BY APPLICATION,
2020–2024 (USD MILLION) 44
TABLE 6 SUBSTRATE-LIKE PCB MARKET, BY APPLICATION, 2017–2024 (USD MILLION) 47
TABLE 7 SUBSTRATE-LIKE PCB MARKET FOR CONSUMER ELECTRONICS APPLICATION,
BY REGION, 2017–2024 (USD MILLION) 49
TABLE 8 SUBSTRATE-LIKE PCB MARKET FOR CONSUMER ELECTRONICS APPLICATION,
BY LINE/SPACE, 2017–2024 (USD MILLION) 49
TABLE 9 SUBSTRATE-LIKE PCB MARKET FOR COMPUTING AND COMMUNICATIONS APPLICATION, BY REGION, 2019–2024 (USD MILLION) 50
TABLE 10 SUBSTRATE-LIKE PCB MARKET FOR COMPUTING & COMMUNICATIONS APPLICATION, BY LINE/SPACE, 2019–2024 (USD MILLION) 51
TABLE 11 SUBSTRATE-LIKE PCB MARKET FOR AUTOMOTIVE APPLICATION, BY REGION, 2019–2024 (USD MILLION) 52
TABLE 12 SUBSTRATE-LIKE PCB MARKET FOR AUTOMOTIVE APPLICATION, BY LINE/SPACE, 2019–2024 (USD MILLION) 52
TABLE 13 SUBSTRATE-LIKE PCB MARKET FOR MEDICAL APPLICATION, BY REGION,
2020–2024 (USD MILLION) 54
TABLE 14 SUBSTRATE-LIKE PCB MARKET FOR MEDICAL APPLICATION, BY LINE/SPACE, 2020–2024 (USD MILLION) 54
TABLE 15 SUBSTRATE-LIKE PCB MARKET FOR INDUSTRIAL APPLICATION, BY REGION,
2020–2024 (USD MILLION) 55
TABLE 16 SUBSTRATE-LIKE PCB MARKET FOR INDUSTRIAL APPLICATION, BY LINE/SPACE, 2020–2024 (USD MILLION) 56
TABLE 17 SUBSTRATE-LIKE PCB MARKET FOR MILITARY, DEFENSE, AND AEROSPACE APPLICATION, BY REGION, 2020–2024 (USD MILLION) 57
TABLE 18 SUBSTRATE-LIKE PCB MARKET FOR MILITARY, DEFENSE, AND AEROSPACE APPLICATION, BY LINE/SPACE, 2020–2024 (USD MILLION) 58
TABLE 19 SUBSTRATE-LIKE PCB MARKET, BY INSPECTION TECHNOLOGY,
2017–2024 (USD MILLION) 61
TABLE 20 SUBSTRATE-LIKE PCB MARKET FOR AUTOMATIC OPTICAL INSPECTION,
BY LINE/SPACE, 2017–2024 (USD MILLION) 63
TABLE 21 SUBSTRATE-LIKE PCB MARKET FOR DIRECT IMAGING, BY LINE/SPACE,
2017–2024 (USD MILLION) 65
TABLE 22 SUBSTRATE-LIKE PCB MARKET FOR AUTOMATED OPTICAL SHAPING,
BY LINE/SPACE, 2017–2024 (USD MILLION) 66
TABLE 23 SUBSTRATE-LIKE PCB MARKET, BY REGION, 2017–2024 (USD MILLION) 68
TABLE 24 SUBSTRATE-LIKE PCB MARKET IN NORTH AMERICA, BY COUNTRY,
2017–2024 (USD MILLION) 70
TABLE 25 SUBSTRATE-LIKE PCB MARKET IN NORTH AMERICA, BY APPLICATION,
2017–2024 (USD MILLION) 71
TABLE 26 SUBSTRATE-LIKE PCB MARKET IN EUROPE, BY COUNTRY,
2019–2024 (USD MILLION) 74
TABLE 27 SUBSTRATE-LIKE PCB MARKET IN EUROPE, BY APPLICATION,
2019–2024 (USD MILLION) 75
TABLE 28 SUBSTRATE-LIKE PCB MARKET IN APAC, BY COUNTRY, 2018–2024 (USD MILLION) 79
TABLE 29 SUBSTRATE-LIKE PCB MARKET IN APAC, BY APPLICATION, 2018–2024
(USD MILLION) 80
TABLE 30 SUBSTRATE-LIKE PCB MARKET IN ROW, BY REGION, 2019–2024 (USD MILLION) 83
TABLE 31 SUBSTRATE-LIKE PCB MARKET IN ROW, BY APPLICATION,
2019–2024 (USD MILLION) 83
TABLE 32 RANKING ANALYSIS OF MARKET PLAYERS, 2017 86
TABLE 33 PRODUCT LAUNCHES, 2016–2018 87
TABLE 34 AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND CONTRACTS, 2017–2018 87
TABLE 35 ACQUISITIONS, 2018 88
TABLE 36 EXPANSIONS, 2017–2018 88


LIST OF FIGURES

FIGURE 1 SUBSTRATE-LIKE PCB MARKET: PROCESS FLOW OF MARKET SIZE ESTIMATION 17
FIGURE 2 SUBSTRATE-LIKE PCB MARKET: RESEARCH DESIGN 18
FIGURE 3 SUBSTRATE-LIKE PCB MARKET: BOTTOM-UP APPROACH 23
FIGURE 4 TOP-DOWN APPROACH TO ARRIVE AT MARKET SIZE 25
FIGURE 5 DATA TRIANGULATION 26
FIGURE 6 ASSUMPTIONS FOR RESEARCH STUDY 27
FIGURE 7 25/25 AND 30/30 µM LINE/SPACE SEGMENT EXPECTED TO HOLD LARGER SIZE OF SUBSTRATE-LIKE PCB MARKET BY 2024 28
FIGURE 8 AUTOMOTIVE APPLICATION TO WITNESS HIGHEST CAGR IN SLP MARKET DURING FORECAST PERIOD 29
FIGURE 9 AUTOMATED OPTICAL INSPECTION TECHNOLOGY EXPECTED TO HOLD LARGEST SHARE OF SUBSTRATE-LIKE PCB MARKET BY 2024 29
FIGURE 10 APAC TO ACCOUNT FOR LARGEST SHARE IN THE SLP MARKET BY 2024 30
FIGURE 11 GROWING ADOPTION OF SLP IN CONSUMER ELECTRONICS APPLICATIONS TO SURGE MARKET GROWTH DURING FORECAST PERIOD 31
FIGURE 12 CONSUMER ELECTRONICS AND CHINA ARE EXPECTED TO ACCOUNT FOR LARGEST SHARE OF SLP MARKET IN APAC IN 2024 32
FIGURE 13 SUBSTRATE-LIKE PCB MARKET IN CHINA TO GROW AT FASTEST RATE DURING FORECAST PERIOD 33
FIGURE 14 SURGE IN DEMAND FOR SMART CONSUMER ELECTRONICS AND WEARABLE DEVICES DRIVES THE SLP MARKET GROWTH 34
FIGURE 15 SUBSTRATE-LIKE PCB MARKET SEGMENTATION, BY LINE/SPACE (L/S) 39
FIGURE 16 25/25 & 30/30 µM LINE/SPACE SEGMENT EXPECTED TO DOMINATE SLP MARKET, IN TERMS OF SIZE, DURING FORECAST PERIOD 40
FIGURE 17 AUTOMATED OPTICAL INSPECTION TECHNOLOGY TO ACCOUNT FOR LARGEST SIZE OF MARKET FOR SLP HAVING 25/25 AND 30/30 µM LINE/SPACE IN 2024 41
FIGURE 18 AUTOMATED OPTICAL INSPECTION TECHNOLOGY-BASED SLP WITH LESS
THAN 25/25 µM LINE/SPACE TO ACCOUNT FOR LARGEST MARKET SIZE DURING 2020–2024 43
FIGURE 19 SUBSTRATE-LIKE PCB MARKET, BY APPLICATION 46
FIGURE 20 CONSUMER ELECTRONICS APPLICATION TO ACCOUNT FOR LARGEST SIZE OF
SLP MARKET IN 2024 47
FIGURE 21 APAC TO DOMINATE SLP MARKET FOR CONSUMER ELECTRONICS APPLICATION DURING FORECAST PERIOD 48
FIGURE 22 25/25 & 30/30 µM LINE/SPACE SEGMENT TO COMMAND SLP MARKET FOR COMPUTING AND COMMUNICATIONS APPLICATIONS DURING FORECAST PERIOD 50
FIGURE 23 APAC TO LEAD SLP MARKET FOR AUTOMOTIVE APPLICATIONS IN COMING YEARS 52
FIGURE 24 NORTH AMERICA TO HOLD LARGEST SIZE OF SLP MARKET FOR MEDICAL APPLICATIONS DURING FORECAST PERIOD 53
FIGURE 25 25/25 & 30/30 µM LINE/SPACE SEGMENT TO HOLD LARGER SIZE OF
SPL MARKET FOR INDUSTRIAL APPLICATION IN 2024 55
FIGURE 26 NORTH AMERICA TO RULE SLP MARKET FOR MILITARY, DEFENSE, AND AEROSPACE APPLICATION DURING FORECAST PERIOD 57
FIGURE 27 SUBSTRATE-LIKE PCB MARKET SEGMENTATION, BY INSPECTION TECHNOLOGY 60
FIGURE 28 SLP MARKET BASED ON AOI TECHNOLOGY TO LEAD THE MARKET BY 2024 61
FIGURE 29 AOI IN MANUFACTURING PROCESS 62
FIGURE 30 25/25 & 30/30 µM LINE/SPACE SEGMENT TO HOLD LARGER SIZE OF
SLP MARKET FOR AOI DURING FORECAST PERIOD 63
FIGURE 31 SCHEMATIC LDI SYSTEM 64
FIGURE 32 APAC TO LEAD SUBSTRATE LIKE PCB MARKET BY 2024 68
FIGURE 33 SUBSTRATE-LIKE PCB MARKET SNAPSHOT IN NORTH AMERICA 69
FIGURE 34 US TO LEAD SUBSTRATE-LIKE PCB MARKET IN NORTH AMERICA DURING FORECAST PERIOD 70
FIGURE 35 SUBSTRATE-LIKE PCB MARKET SNAPSHOT IN EUROPE 73
FIGURE 36 GERMANY TO HOLD LARGEST SIZE OF SUBSTRATE-LIKE PCB MARKET IN EUROPE DURING FORECAST PERIOD 74
FIGURE 37 SUBSTRATE-LIKE PCB MARKET SNAPSHOT IN APAC 78
FIGURE 38 CHINA TO COMMAND SUBSTRATE-LIKE PCB MARKET IN APAC WITH LARGEST SIZE DURING FORECAST PERIOD 79
FIGURE 39 SOUTH AMERICA TO LEAD SUBSTRATE-LIKE PCB MARKET IN ROW DURING FORECAST PERIOD 82
FIGURE 40 ORGANIC AND INORGANIC STRATEGIES ADOPTED BY COMPANIES OPERATING IN SUBSTRATE-LIKE PCB MARKET 85
FIGURE 41 KINSUS INTERCONNECT TECHNOLOGY: COMPANY SNAPSHOT 90
FIGURE 42 IBIDEN: COMPANY SNAPSHOT 93
FIGURE 43 COMPEQ: COMPANY SNAPSHOT 95
FIGURE 44 UNIMICRON: COMPANY SNAPSHOT 97
FIGURE 45 AT&S: COMPANY SNAPSHOT 100
FIGURE 46 TTM TECHNOLOGIES: COMPANY SNAPSHOT 103
FIGURE 47 SAMSUNG ELECTRO-MECHANICS: COMPANY SNAPSHOT 106
FIGURE 48 KOREA CIRCUIT: COMPANY SNAPSHOT 108
FIGURE 49 ZHEN DING TECHNOLOGY: COMPANY SNAPSHOT 110



★調査レポート[サブストレートライクPCB(SLP)の世界市場予測(~2024年)] ( Substrate-Like PCB Market by Line/Spacing (25/25 & 30/30 µm and Less than 25/25 µm), Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2024 / SE 6851) 販売に関する免責事項
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