Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to 2023

ハイブリッドメモリキューブ(HMC)及び高帯域幅メモリー(HBM)の世界市場予測(~2023年)

◆タイトル:Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to 2023
◆商品コード:SE-4220
◆調査・発行会社:MarketsandMarkets
◆発行日:2018年3月6日
◆ページ数:136
◆レポート形式:PDF / 英語
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【レポートの概要】

MarketsandMarketsが発行した当調査レポートでは、ハイブリッドメモリキューブ(HMC)及び高帯域幅メモリー(HBM)の世界市場について調査・分析し、エグゼクティブサマリー、市場インサイト、市場概観/市場動向、バリューチェーン分析、市場シェア分析、メモリ種類別分析、製品種類別分析、用途別分析、地域別分析、ハイブリッドメモリキューブ(HMC)及び高帯域幅メモリー(HBM)の世界市場規模及び予測、市場動向、競争状況、関連企業分析などの情報をお届けいたします。

The overall HMC and HBM market is expected to increase from USD 922.7 Million in 2018 to USD 3,842.5 Million by 2023, at a CAGR of 33.02% between 2018 and 2023. The growing need for high-bandwidth, low power consuming, and highly scalable memories; increasing adoption of artificial intelligence; and rising trend of miniaturization of electronic devices are some of the factors driving market growth.
The HMC segment accounted for the largest market share in 2017 mainly due to its higher bandwidth offering than HBM. Moreover, the primary application that HMC serves is high-performance computing, which is gaining traction owing to the developments in artificial intelligence and machine learning. HMC also acts as a far memory and supports capability expansion through the chaining process which is attached to the CPU for a maximum of eight cubes. This ensures scalability which is demanded in high-performance computing. All these factors are supporting the adoption of the HMC technology.

The market for APU is expected to grow at the highest rate during the forecast period. An HBM-based APU is a recent innovation by AMD (US) developed to meet the requirements of high-performance computing. APUs integrate both GPU and CPU capabilities on a single SoC. This further improves the overall energy efficiency of APUs by eliminating connections between chips. APUs can also be used for graphics applications. Moreover, AMD (US), the leading manufacturer of APUs, demonstrated an APU with integrated HBM and stacked non-volatile memory cells. This will also serve to drive the adoption of APUs in computing applications.

The market for high-performance computing accounted for the largest market share in 2017. High-performance computing has gained traction in the last few years owing to the various developments in artificial intelligence and machine learning. The increasing computational power in the cloud and advancements in sophisticated algorithms are driving the adoption of artificial intelligence by several companies. Along with improvements in AI algorithms, an increasing number of hardware solutions also need advanced devices, which will drive the demand for high-performing memory and processors. Intel (US) has already integrated deep-learning instructions in its Xeon and Xeon Phi processors which use the HMC technology.

Hybrid Memory Cube and High-Bandwidth Memory Market

In terms of geographic regions, APAC is expected to grow at the highest CAGR during the forecast period. The major drivers for the rapid growth of the HMC and HBM market in APAC are the growing number of data centers and servers, increasing shipments of network equipment, and the rising number of manufacturing activities in the enterprise storage and consumer electronics sectors. The strong economic growth and growing demand for high-density memories is expected to drive the HMC and HBM market in the APAC region.

However, the thermal issues caused by high level of integration is restraining the growth of the HMC and HBM market.

Key players in the HMC and HBM market include Samsung (South Korea), Micron (US), SK Hynix (South Korea), Intel (US), and AMD (US). Samsung has been at the top position because of its wide contribution to the parent market share and high financial power. The company’s strong market position, coupled with strong brand equity, imparts a significant competitive edge. The company is part of the hybrid memory cube consortium and has begun the mass production of its high-bandwidth memory for computing, enterprise servers and advanced graphics, and network systems.

【レポートの目次】

1 Introduction (Page No. – 13)
1.1 Study Objectives
1.2 Definition
1.3 Study Scope
1.3.1 Markets Covered
1.3.2 Geographic Scope
1.3.3 Years Considered for the Study
1.4 Currency
1.5 Limitations
1.6 Stakeholders

2 Research Methodology (Page No. – 16)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Secondary Sources
2.1.2 Primary Data
2.1.2.1 Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primary Interviews
2.1.3 Secondary and Primary Research
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.1.1 Approach for Capturing the Market Size By Bottom-Up Analysis (Demand Side)
2.2.2 Top-Down Approach
2.2.2.1 Approach for Capturing the Market Share By Top-Down Analysis (Supply Side)
2.3 Data Triangulation
2.4 Assumptions

3 Executive Summary (Page No. – 26)

4 Premium Insights (Page No. – 31)
4.1 HMC and HBM Market Overview
4.2 HMC Market, By Application
4.3 HMC and HBM Market in APAC
4.4 Geographic Snapshot of the HMC and HBM Market
4.5 HMC and HBM Market in APAC, By Country

5 Market Overview (Page No. – 34)
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 Growing Need for High-Bandwidth, Low Power Consuming, and Highly Scalable Memories
5.2.1.2 Increasing Adoption of Artificial Intelligence
5.2.1.3 Rising Trend of Miniaturization of Electronic Devices
5.2.2 Restraints
5.2.2.1 Thermal Issues Caused By High Levels of Integration
5.2.3 Opportunities
5.2.3.1 High Demand for Cloud-Based Services
5.2.3.2 Growing Big Data
5.2.4 Challenges
5.2.4.1 Design Complexities Associated With HMC and HBM
5.2.4.2 Ecosystem Development
5.3 Value Chain Analysis

6 HMC and HBM Market, By Memory Type (Page No. – 41)
6.1 Introduction
6.2 Hybrid Memory Cube (HMC)
6.3 High-Bandwidth Memory (HBM)

7 HMC and HBM Market, By Product Type (Page No. – 46)
7.1 Introduction
7.2 Central Processing Unit
7.3 Field-Programmable Gate Array
7.4 Graphics Processing Unit
7.5 Application-Specific Integrated Circuit
7.6 Accelerated Processing Unit

8 HMC and HBM Market, By Application (Page No. – 55)
8.1 Introduction
8.2 High-Performance Computing (HPC)
8.3 Networking
8.4 Data Centers
8.5 Graphics

9 Geographic Analysis (Page No. – 63)
9.1 Introduction
9.2 North America
9.2.1 US
9.2.2 Canada
9.2.3 Mexico
9.3 Europe
9.3.1 UK
9.3.2 Germany
9.3.3 France
9.3.4 Rest of Europe
9.4 APAC
9.4.1 China
9.4.2 Japan
9.4.3 South Korea
9.4.4 Taiwan
9.4.5 Rest of APAC
9.5 RoW
9.5.1 Middle East and Africa
9.5.2 South America

10 Competitive Landscape (Page No. – 91)
10.1 Overview
10.2 Ranking Analysis
10.3 Competitive Scenario
10.3.1 Product Developments and Launches
10.3.2 Partnerships, Agreements, and Collaborations
10.3.3 Acquisitions
10.3.4 Investments and Expansions

11 Company Profiles (Page No. – 97)
(Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View)*
11.1 Key Players
11.1.1 Micron
11.1.2 Samsung
11.1.3 SK Hynix
11.1.4 Advanced Micro Devices
11.1.5 Intel
11.1.6 Xilinx
11.1.7 Fujitsu
11.1.8 Nvidia
11.1.9 IBM
11.1.10 Open-Silicon
11.2 Other Key Companies
11.2.1 Arira
11.2.2 Cadence
11.2.3 Marvell
11.2.4 Cray
11.2.5 Rambus
11.2.6 Arm

*Details on Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View Might Not Be Captured in Case of Unlisted Companies.

12 Appendix (Page No. – 125)
12.1 Insights of Industry Experts
12.2 Discussion Guide
12.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
12.4 Introducing RT: Real-Time Market Intelligence
12.5 Available Customizations
12.6 Related Reports
12.7 Author Details

List of Tables (72 Tables)

Table 1 HMC and HBM Market, By Memory Type, 2016–2023 (USD Million)
Table 2 HBM2 vs HMC (Gen3)
Table 3 HMC Market, By Application, 2016–2023 (USD Million)
Table 4 HBM Market, By Application, 2016–2023 (USD Million)
Table 5 HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 6 HMC and HBM Market for Central Processing Unit, By Application, 2016–2023 (USD Million)
Table 7 HMC and HBM Market for Central Processing Unit, By Region, 2016–2023 (USD Million)
Table 8 HMC and HBM Market for Field-Programmable Gate Array, By Application, 2016–2023 (USD Million)
Table 9 HMC and HBM Market for Field-Programmable Gate Array, By Region, 2016–2023 (USD Million)
Table 10 HMC and HBM Market for Graphics Processing Unit, By Application, 2016–2023 (USD Million)
Table 11 HMC and HBM Market for Graphics Processing Unit Market, By Region, 2016–2023 (USD Million)
Table 12 HMC and HBM Market for Application-Specific Integrated Circuit, By Application, 2016–2023 (USD Million)
Table 13 HMC and HBM, Market for Application-Specific Integrated Circuit, By Region, 2016–2023 (USD Million)
Table 14 HMC and HBM Market for Accelerated Processing Unit Market, By Application, 2016–2023 (USD Million)
Table 15 HMC and HBM Market for Accelerated Processing Unit, By Region, 2016–2023 (USD Million)
Table 16 HMC and HBM Market, By Application, 2016–2023 (USD Million)
Table 17 HMC and HBM Market for High-Performance Computing, By Memory Type, 2016–2023 (USD Million)
Table 18 HMC and HBM Market for High-Performance Computing, By Product Type, 2016–2023 (USD Million)
Table 19 HMC and HBM Market for Networking Applications, By Memory Type, 2016–2023 (USD Million)
Table 20 HMC and HBM Market for Networking, By Product Type, 2016–2023 (USD Million)
Table 21 HMC and HBM Market for Data Center Applications, By Memory Type, 2016–2023 (USD Million)
Table 22 HMC and HBM Market for Data Center Applications, By Product Type, 2016–2023 (USD Million)
Table 23 HMC and HBM Market for Graphics, By Memory Type, 2016–2023 (USD Million)
Table 24 HMC and HBM Market for Graphics, By Product Type, 2016–2023 (USD Million)
Table 25 HMC and HBM Market, By Region, 2016–2023 (USD Million)
Table 26 North America: HMC and HBM Market, By Country, 2016–2023 (USD Million)
Table 27 North America: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 28 North America: Graphics Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 29 North America: Central Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 30 North America: Accelerated Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 31 North America: Field-Programmable Gate Array Market, By Country, 2016–2023 (USD Million)
Table 32 North America: Application-Specific Integrated Circuit Market, By Country, 2016–2023 (USD Million)
Table 33 US: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 34 Canada: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 35 Mexico: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 36 Europe: HMC and HBM Market, By Country, 2016–2023 (USD Million)
Table 37 Europe: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 38 Europe: Graphics Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 39 Europe: Central Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 40 Europe: Accelerated Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 41 Europe: Field-Programmable Gate Array Market, By Country, 2016–2023 (USD Million)
Table 42 Europe: Application-Specific Integrated Circuit Market, By Country, 2016–2023 (USD Million)
Table 43 UK: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 44 Germany: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 45 France: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 46 RoE: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 47 APAC: HMC and HBM Market, By Country, 2016–2023 (USD Million)
Table 48 APAC: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 49 APAC: Graphics Processing Units Market, By Country, 2016–2023 (USD Million)
Table 50 APAC: Central Processing Units Market, By Country, 2016–2023 (USD Million)
Table 51 APAC: Accelerated Processing Units Market, By Country, 2016–2023 (USD Million)
Table 52 APAC: Field-Programmable Gate Arrays Market, By Country, 2016–2023 (USD Million)
Table 53 APAC: Application-Specific Integrated Circuits Market, By Country, 2016–2023 (USD Million)
Table 54 China: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 55 Japan: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 56 South Korea: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 57 Taiwan: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 58 RoA: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 59 RoW: HMC and HBM Market, By Region, 2016–2023 (USD Million)
Table 60 RoW: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 61 RoW: Graphics Processing Units Market, By Region, 2016–2023 (USD Million)
Table 62 RoW: Central Processing Units Market, By Region, 2016–2023 (USD Million)
Table 63 RoW: Accelerated Processing Units Market, By Region, 2016–2023 (USD Million)
Table 64 RoW: Field-Programmable Gate Arrays Market, By Region, 2016–2023 (USD Million)
Table 65 RoW: Application-Specific Integrated Circuits Market, By Region, 2016–2023 (USD Million)
Table 66 Middle East and Africa: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 67 South America: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 68 Ranking Analysis of the Top 5 Players in the HMC and HBM Market
Table 69 Product Developments and Launches, 2016–2017
Table 70 Partnerships, Agreements, and Collaborations, 2015–2017
Table 71 Acquisitions, 2015
Table 72 Investments and Expansions, 2013–2014

List of Figures (43 Figures)

Figure 1 HMC and HBM Market Segmentation
Figure 2 Research Flow
Figure 3 HMC and HBM Market: Research Design
Figure 4 Bottom-Up Approach
Figure 5 Top-Down Approach
Figure 6 Data Triangulation
Figure 7 HBM to Register the Higher CAGR in the HMC & HBM Market During the Forecast Period
Figure 8 Market for APU to Grow at the Highest CAGR During the Forecast Period
Figure 9 CPU Market for High-Performance Computing to Account for the Largest Market Share During the Forecast Period
Figure 10 HMC and HBM Market for Graphics Applications to Grow at the Highest CAGR During 2018–2023
Figure 11 North America to Account for the Largest Market Share in 2017
Figure 12 High-Performance Computing Applications to Drive the Market for HMC and HBM
Figure 13 HMC Market for Graphics Applications to Grow at the Highest CAGR During the Forecast Period
Figure 14 CPU Segment Held the Largest Share of the HMC and HBM Market in APAC in 2017
Figure 15 HMC and HBM Market in APAC to Grow at the Highest CAGR During the Forecast Period
Figure 16 HMC and HBM Market in South Korea to Grow at the Highest CAGR During the Forecast Period
Figure 17 Growing Need for High-Bandwidth, Low Power Consuming, and Highly Scalable Memories is Driving the Growth of the HMC and HBM Market
Figure 18 Big Data Volume, 2014–2020 (Zettabytes)
Figure 19 Value Chain: HMC and HBM Market, 2017
Figure 20 HBM to Register the Highest Growth Rate in the HMC & HBM Market During the Forecast Period
Figure 21 Accelerated Processing Unit Segment to Grow at the Highest CAGR in the HMC and HBM Market During the Forecast Period
Figure 22 High-Performance Computing, the Largest Application Segment in the Central Processing Unit Market
Figure 23 Market for APU in APAC to Grow at the Highest CAGR During the Forecast Period
Figure 24 HMC and HBM Market for Graphics to Grow at the Highest CAGR During the Forecast Period
Figure 25 APU HMC and HBM Market for High-Performance Computing to Grow at the Highest CAGR During the Forecast Period
Figure 26 Geographic Snapshot: APAC Countries to Register Highest Growth During the Forecast Period (2018–2023)
Figure 27 APAC Market to Grow at the Highest CAGR During the Forecast Period
Figure 28 Market Snapshot: North America
Figure 29 APU Segment to Grow at the Highest CAGR During the Forecast Period in the Us
Figure 30 Market Snapshot: Europe
Figure 31 Accelerated Processing Unit Segment to Grow at the Highest Rate in the RoE Market During the Forecast Period
Figure 32 Market Snapshot: APAC
Figure 33 Central Processing Units Segment to Hold Largest Share of the Market in China
Figure 34 Companies Adopted Product Developments and Launches as the Key Growth Strategy Over the Last Five Years (2013–2017)
Figure 35 Micron: Company Snapshot
Figure 36 Samsung: Company Snapshot
Figure 37 SK Hynix: Company Snapshot
Figure 38 AMD: Company Snapshot
Figure 39 Intel: Company Snapshot
Figure 40 Xilinx: Company Snapshot
Figure 41 Fujitsu: Company Snapshot
Figure 42 Nvidia: Company Snapshot
Figure 43 IBM: Company Snapshot



【レポートのキーワード】

ハイブリッドメモリキューブ(HMC)、高帯域幅メモリー(HBM)

★調査レポート[ハイブリッドメモリキューブ(HMC)及び高帯域幅メモリー(HBM)の世界市場予測(~2023年)] ( Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to 2023 / SE-4220) 販売に関する免責事項
[ハイブリッドメモリキューブ(HMC)及び高帯域幅メモリー(HBM)の世界市場予測(~2023年)] ( Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to 2023 / SE-4220) についてEメールでお問い合わせ


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